Ronald L. Spreitzer

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device mounting with folded substrate and interp...
- Patent number 7,818,878
- Issue date Oct 26, 2010
- Intel Corporation
- Robert M. Nickerson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Folded substrate with interposer package for integrated circuit dev...
- Patent number 7,358,444
- Issue date Apr 15, 2008
- Intel Corporation
- Robert M. Nickerson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power distribution within a folded flex package method and apparatus
- Patent number 7,304,373
- Issue date Dec 4, 2007
- Intel Corporation
- Brian Taggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond finger on via substrate, process of making same, package made...
- Patent number 7,302,756
- Issue date Dec 4, 2007
- Intel Corporation
- Brian Taggart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit interconnect
- Patent number 6,794,760
- Issue date Sep 21, 2004
- Intel Corporation
- Edward Jaeck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH MULTIPLE PHOTONIC INTEGRATED CIRCUIT DIES OPTICALLY CO...
- Publication number 20230318247
- Publication date Oct 5, 2023
- Intel Corporation
- Eleanor Patricia Paras RABADAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES TO ENABLE A FLIP CHIP UNDERFILL EXCLUSION ZONE
- Publication number 20230207412
- Publication date Jun 29, 2023
- Intel Corporation
- Ronald SPREITZER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERPOSER INTERCONNECTS AND ENCLOSURE FOR SILICON PHOTONICS LIDAR...
- Publication number 20230197699
- Publication date Jun 22, 2023
- Ronald L. Spreitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PHOTONIC SYSTEMS FOR LIDAR APPLICATIONS
- Publication number 20220404474
- Publication date Dec 22, 2022
- Intel Corporation
- Eleanor Patricia Paras Rabadam
- G02 - OPTICS
Information Patent Application
ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE
- Publication number 20220390562
- Publication date Dec 8, 2022
- Guiyun Bai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FOLDED SUBSTRATE WITH INTERPOSER PACKAGE FOR INTEGRATED CIRCUIT DEV...
- Publication number 20080148559
- Publication date Jun 26, 2008
- Robert M. NICKERSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging logic and memory integrated circuits
- Publication number 20060289981
- Publication date Dec 28, 2006
- Robert M. Nickerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power distribution within a folded flex package method and apparatus
- Publication number 20060091508
- Publication date May 4, 2006
- Brian Taggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Folded substrate with interposer package for integrated circuit dev...
- Publication number 20060077644
- Publication date Apr 13, 2006
- Robert M. Nickerson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-chips on flex substrates, flip-chip and wire-bonded chip stack...
- Publication number 20060033217
- Publication date Feb 16, 2006
- Brian Taggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-line wire bonding on a package, and method of assembling same
- Publication number 20060001180
- Publication date Jan 5, 2006
- Brian Taggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assembly having a redistribution conductor over a m...
- Publication number 20050230850
- Publication date Oct 20, 2005
- Brian C. Taggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lower profile flexible substrate package for electronic components
- Publication number 20050214978
- Publication date Sep 29, 2005
- Brian Taggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond finger on via substrate, process of making same, package made...
- Publication number 20040262039
- Publication date Dec 30, 2004
- Brian Taggart
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Ronald L. Spreitzer

Person

Patents Grantslast 30 patents

Integrated circuit device mounting with folded substrate and interp...

Folded substrate with interposer package for integrated circuit dev...

Power distribution within a folded flex package method and apparatus

Bond finger on via substrate, process of making same, package made...

Integrated circuit interconnect

Patents Applicationslast 30 patents

PACKAGE WITH MULTIPLE PHOTONIC INTEGRATED CIRCUIT DIES OPTICALLY CO...

TECHNIQUES TO ENABLE A FLIP CHIP UNDERFILL EXCLUSION ZONE

INTERPOSER INTERCONNECTS AND ENCLOSURE FOR SILICON PHOTONICS LIDAR...

SILICON PHOTONIC SYSTEMS FOR LIDAR APPLICATIONS

ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE

FOLDED SUBSTRATE WITH INTERPOSER PACKAGE FOR INTEGRATED CIRCUIT DEV...

Packaging logic and memory integrated circuits

Power distribution within a folded flex package method and apparatus

Folded substrate with interposer package for integrated circuit dev...

Flip-chips on flex substrates, flip-chip and wire-bonded chip stack...

In-line wire bonding on a package, and method of assembling same

Microelectronic assembly having a redistribution conductor over a m...

Lower profile flexible substrate package for electronic components

Bond finger on via substrate, process of making same, package made...