Ronald R. Denny

Person

Brooklyn Center, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Expandable fluid cooling structure
- Patent number 8,534,347
- Issue date Sep 17, 2013
- General Dynamics Advanced Information Systems, Inc.
- Ronald R. Denny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for managing addresses in a computing system
- Patent number 8,037,259
- Issue date Oct 11, 2011
- General Dynamics Advanced Information Systems, Inc.
- William J. Leinberger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming laminated multiple substrates
- Patent number 8,028,403
- Issue date Oct 4, 2011
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for interconnecting circuit boards
- Patent number 7,819,667
- Issue date Oct 26, 2010
- General Dynamics Advanced Information Systems, Inc.
- Bobby Jim Kowalski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a federation control plane in an orthogona...
- Patent number 7,802,046
- Issue date Sep 21, 2010
- General Dynamics Advanced Information Systems, Inc.
- Bobby Jim Kowalski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Technique for laminating multiple substrates
- Patent number 7,490,402
- Issue date Feb 17, 2009
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated multiple substrates
- Patent number 7,282,787
- Issue date Oct 16, 2007
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated multilayer package
- Patent number 6,856,008
- Issue date Feb 15, 2005
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing laminated high layer count printed circui...
- Patent number 6,742,247
- Issue date Jun 1, 2004
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for adjusting the clock delay in systems with...
- Patent number 6,621,882
- Issue date Sep 16, 2003
- General Dynamics Information Systems, Inc.
- Ronald R. Denny
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Laminated multilayer substrates
- Patent number 5,986,339
- Issue date Nov 16, 1999
- General Dynamics Information Systems, Inc.
- Deepak K. Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated multilayer substrates
- Patent number 5,786,238
- Issue date Jul 28, 1998
- Generyal Dynamics Information Systems, Inc.
- Deepak K. Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector for orthogonally mounting circuit boards
- Patent number 4,708,660
- Issue date Nov 24, 1987
- Control Data Corporation
- Richard J. Claeys
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Expandable fluid cooling structure
- Publication number 20110168375
- Publication date Jul 14, 2011
- General Dynamics Advanced Information Systems, Inc.
- Bobby Jim Kowalski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for laminating multiple substrates
- Publication number 20090151158
- Publication date Jun 18, 2009
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for interconnecting circuit boards
- Publication number 20090149039
- Publication date Jun 11, 2009
- General Dynamics Advanced Information Systems, Inc.
- Bobby Jim Kowalski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for managing addresses in a computing system
- Publication number 20080301390
- Publication date Dec 4, 2008
- General Dynamics Information Systems, Inc.
- William J. Leinberger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for a federation control plane in an orthogona...
- Publication number 20080276031
- Publication date Nov 6, 2008
- General Dynamics Advanced Information Systems, Inc.
- Bobby Jim Kowalski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Technique for laminating multiple substrates
- Publication number 20080066304
- Publication date Mar 20, 2008
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Technique for laminating multiple substrates
- Publication number 20040246688
- Publication date Dec 9, 2004
- General Dynamics Advanced Information Systems, Inc
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminated multilayer package
- Publication number 20040032028
- Publication date Feb 19, 2004
- General Dynamics Advanced Information Systems, Inc
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lamination of high-layer-count substrates
- Publication number 20030174484
- Publication date Sep 18, 2003
- General Dynamics Advanced Information Systems, Inc
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for adjusting the clock delay in systems with...
- Publication number 20030026367
- Publication date Feb 6, 2003
- Ronald R. Denny
- G06 - COMPUTING CALCULATING COUNTING

Ronald R. Denny

Person

Patents Grantslast 30 patents

Expandable fluid cooling structure

System and method for managing addresses in a computing system

Method for forming laminated multiple substrates

System and method for interconnecting circuit boards

Method and apparatus for a federation control plane in an orthogona...

Technique for laminating multiple substrates

Laminated multiple substrates

Laminated multilayer package

Process for manufacturing laminated high layer count printed circui...

Method and apparatus for adjusting the clock delay in systems with...

Laminated multilayer substrates

Laminated multilayer substrates

Connector for orthogonally mounting circuit boards

Patents Applicationslast 30 patents

Expandable fluid cooling structure

Technique for laminating multiple substrates

System and method for interconnecting circuit boards

System and method for managing addresses in a computing system

Method and apparatus for a federation control plane in an orthogona...

Technique for laminating multiple substrates

Technique for laminating multiple substrates

Laminated multilayer package

Lamination of high-layer-count substrates

Method and apparatus for adjusting the clock delay in systems with...