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Ronen Sinai
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Yokneam, IL
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last 30 patents
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Patent Grant
Package system having laterally offset and ovelapping chip packages
Patent number
11,088,123
Issue date
Aug 10, 2021
Marvell Israel (M.I.S.L) Ltd.
Dan Azeroual
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Packaging arrangements including high density interconnect bridge
Patent number
10,438,881
Issue date
Oct 8, 2019
Marvell World Trade Ltd.
Long-Ching Wang
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
PACKAGING ARRANGEMENTS INCLUDING HIGH DENSITY INTERCONNECT BRIDGE
Publication number
20170125334
Publication date
May 4, 2017
Marvell World Trade Ltd.
Long-Ching Wang
H01 - BASIC ELECTRIC ELEMENTS