Rong Tao

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,075,165
- Issue date Jul 27, 2021
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for filling substrate features with cobalt
- Patent number 10,304,732
- Issue date May 28, 2019
- Applied Materials, Inc.
- Wenting Hou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 10,047,430
- Issue date Aug 14, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming cobalt-copper selective fill for an interconnect
- Patent number 10,014,179
- Issue date Jul 3, 2018
- Applied Materials, Inc.
- Rong Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming layers on a substrate
- Patent number 8,993,434
- Issue date Mar 31, 2015
- Applied Materials, Inc.
- Jick M. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,696,875
- Issue date Apr 15, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,668,816
- Issue date Mar 11, 2014
- Applied Materials Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering of thermally resistive materials including metal chalcog...
- Patent number 8,500,963
- Issue date Aug 6, 2013
- Applied Materials, Inc.
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bottom up plating by organic surface passivation and differential p...
- Patent number 8,293,647
- Issue date Oct 23, 2012
- Applied Materials, Inc.
- Jenn-Yue Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Auxiliary magnet array in conjunction with magnetron sputtering
- Patent number 6,875,321
- Issue date Apr 5, 2005
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Continuous, non-agglomerated adhesion of a seed layer to a barrier...
- Patent number 6,627,542
- Issue date Sep 30, 2003
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnet array in conjunction with rotating magnetron for plasma sput...
- Patent number 6,610,184
- Issue date Aug 26, 2003
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual damascene metallization
- Patent number 6,207,222
- Issue date Mar 27, 2001
- Applied Materials, Inc.
- Liang-Yuh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IMP technology with heavy gas sputtering
- Patent number 6,200,433
- Issue date Mar 13, 2001
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature integrated via and trench fill process and apparatus
- Patent number 6,139,697
- Issue date Oct 31, 2000
- Applied Materials, Inc.
- Liang-Yuh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene metallization
- Patent number 5,989,623
- Issue date Nov 23, 1999
- Applied Materials, Inc.
- Liang-Yuh Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220310364
- Publication date Sep 29, 2022
- Applied Materials, Inc.
- Halbert CHONG
- B08 - CLEANING
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220310363
- Publication date Sep 29, 2022
- Applied Materials, Inc.
- Halbert CHONG
- B08 - CLEANING
Information Patent Application
Ruthenium Reflow For Via Fill
- Publication number 20220223472
- Publication date Jul 14, 2022
- Applied Materials, Inc.
- Yi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20210319989
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- Halbert CHONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS
- Publication number 20210320064
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- SUKETU A. PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS
- Publication number 20210020569
- Publication date Jan 21, 2021
- Applied Materials, Inc.
- SUKETU A. PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FILLING SUBSTRATE FEATURES WITH COBALT
- Publication number 20190088540
- Publication date Mar 21, 2019
- Applied Materials, Inc.
- Wenting Hou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20180327893
- Publication date Nov 15, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING COBALT-COPPER SELECTIVE FILL FOR AN INTERCONNECT
- Publication number 20160240432
- Publication date Aug 18, 2016
- Applied Materials, Inc.
- RONG TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FILM DEPOSITION
- Publication number 20150136732
- Publication date May 21, 2015
- Applied Materials, Inc.
- Xianmin TANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRA-THIN COPPER SEED LAYER FOR ELECTROPLATING INTO SMALL FEATURES
- Publication number 20140374907
- Publication date Dec 25, 2014
- Jick M. YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20140305802
- Publication date Oct 16, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRA-THIN COPPER SEED LAYER FOR ELECTROPLATING INTO SMALL FEATURES
- Publication number 20130341794
- Publication date Dec 26, 2013
- Applied Materials, Inc.
- Jick M. YU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR FORMING LAYERS ON A SUBSTRATE
- Publication number 20120070982
- Publication date Mar 22, 2012
- Applied Materials, Inc.
- JICK M. YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM UP PLATING BY ORGANIC SURFACE PASSIVATION AND DIFFERENTIAL P...
- Publication number 20100130007
- Publication date May 27, 2010
- Applied Materials, Inc.
- JENN-YUE WANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20090233438
- Publication date Sep 17, 2009
- Applied Materials, Inc.
- Peijun DING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHALCOGENIDE TARGET AND METHOD
- Publication number 20090107834
- Publication date Apr 30, 2009
- APPLIED MATERIALS, INC.
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20080110747
- Publication date May 15, 2008
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING OF THERMALLY RESISTIVE MATERIALS INCLUDING METAL CHALCOG...
- Publication number 20080099326
- Publication date May 1, 2008
- Applied Meterials, Inc.
- MENGQI YE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20050255691
- Publication date Nov 17, 2005
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20050006222
- Publication date Jan 13, 2005
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Auxiliary magnet array in conjunction with magnetron sputtering
- Publication number 20040035692
- Publication date Feb 26, 2004
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Magnet array in conjunction with rotating magnetron for plasma sput...
- Publication number 20030089601
- Publication date May 15, 2003
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Burn-in process for high density plasma PVD chamber
- Publication number 20020144889
- Publication date Oct 10, 2002
- APPLIED MATERIALS, INC.
- Rong Tao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Methods and apparatus for forming dual metal interconnects

Methods and apparatus for forming dual metal interconnects

Methods and apparatus for filling substrate features with cobalt

Self-ionized and inductively-coupled plasma for sputtering and resp...

Methods for forming cobalt-copper selective fill for an interconnect

Methods for forming layers on a substrate

Self-ionized and inductively-coupled plasma for sputtering and resp...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Sputtering of thermally resistive materials including metal chalcog...

Bottom up plating by organic surface passivation and differential p...

Auxiliary magnet array in conjunction with magnetron sputtering

Continuous, non-agglomerated adhesion of a seed layer to a barrier...

Magnet array in conjunction with rotating magnetron for plasma sput...

Dual damascene metallization

IMP technology with heavy gas sputtering

Low temperature integrated via and trench fill process and apparatus

Dual damascene metallization

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

Ruthenium Reflow For Via Fill

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS

METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS

METHODS AND APPARATUS FOR FILLING SUBSTRATE FEATURES WITH COBALT

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

METHODS FOR FORMING COBALT-COPPER SELECTIVE FILL FOR AN INTERCONNECT

METHOD AND APPARATUS FOR FILM DEPOSITION

ULTRA-THIN COPPER SEED LAYER FOR ELECTROPLATING INTO SMALL FEATURES

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

ULTRA-THIN COPPER SEED LAYER FOR ELECTROPLATING INTO SMALL FEATURES

METHODS FOR FORMING LAYERS ON A SUBSTRATE

BOTTOM UP PLATING BY ORGANIC SURFACE PASSIVATION AND DIFFERENTIAL P...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

CHALCOGENIDE TARGET AND METHOD

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

SPUTTERING OF THERMALLY RESISTIVE MATERIALS INCLUDING METAL CHALCOG...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Auxiliary magnet array in conjunction with magnetron sputtering

Magnet array in conjunction with rotating magnetron for plasma sput...

Burn-in process for high density plasma PVD chamber