Ronilo V. Boja

Follow

Person

Gilroy, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package having a cover with window
- Patent number 11,201,095
- Issue date Dec 14, 2021
- Xilinx, Inc.
- Ronilo Boja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly with composite stiffener
- Patent number 10,764,996
- Issue date Sep 1, 2020
- Xilinx, Inc.
- Ronilo Boja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly with surface mounted component protection
- Patent number 10,438,863
- Issue date Oct 8, 2019
- Xilinx, Inc.
- Ronilo Boja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a printed circuit board having high densi...
- Patent number 10,219,387
- Issue date Feb 26, 2019
- NVIDIA Corporation
- Leilei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System, method, and computer program product for a cavity package-o...
- Patent number 9,659,815
- Issue date May 23, 2017
- NVIDIA Corporation
- Ronilo V. Boja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging devices and methods
- Patent number 8,810,028
- Issue date Aug 19, 2014
- Xilinx, Inc.
- Nael Zohni
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM, METHOD, AND COMPUTER PROGRAM PRODUCT FOR A CAVITY PACKAGE-O...
- Publication number 20150206848
- Publication date Jul 23, 2015
- NVIDIA Corporation
- Ronilo V. Boja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MANUFACTURING A PRINTED CIRCUIT BOARD HAVING HIGH DENSI...
- Publication number 20140208590
- Publication date Jul 31, 2014
- NVIDIA Corporation
- Leilei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR