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Ronnie J. Yenchik
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Blodgett, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Bonding an interconnect to a circuit device and related devices
Patent number
7,716,823
Issue date
May 18, 2010
Hewlett-Packard Development Company, L.P.
Neal Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly with a ring and bonding pads formed of a same material on...
Patent number
7,262,498
Issue date
Aug 28, 2007
Hewlett-Packard Development Company, L.P.
David M. Craig
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Droplet plate architecture
Patent number
6,837,572
Issue date
Jan 4, 2005
Hewlett-Packard Development Company, L.P.
Ravi Ramaswami
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Fluid ejector head having a planar passivation layer
Patent number
6,834,942
Issue date
Dec 28, 2004
Hewlett-Packard Development Company, L.P.
Kenneth E Trueba
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Fluid ejector head having a planar passivation layer
Patent number
6,767,474
Issue date
Jul 27, 2004
Hewlett-Packard Development Company, L.P.
Kenneth E Trueba
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Method of forming a through-substrate interconnect
Patent number
6,716,737
Issue date
Apr 6, 2004
Hewlett-Packard Development Company, L.P.
Hubert Vander Plas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Droplet plate architecture
Patent number
6,682,874
Issue date
Jan 27, 2004
Hewlett-Packard Development Company L.P.
Ravi Ramaswami
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Droplet plate architecture in ink-jet printheads
Patent number
6,482,574
Issue date
Nov 19, 2002
Hewlett-Packard Co.
Ravi Ramaswami
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Patents Applications
last 30 patents
Information
Patent Application
Assembly
Publication number
20060081994
Publication date
Apr 20, 2006
David M. Craig
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Bonding an interconnect to a circuit device and related devices
Publication number
20050223552
Publication date
Oct 13, 2005
Neal Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fluid ejector head having a planar passivation layer
Publication number
20040212663
Publication date
Oct 28, 2004
Kenneth E. Trueba
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
Droplet plate architecture
Publication number
20040032456
Publication date
Feb 19, 2004
Ravi Ramaswami
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
METHOD OF FORMING A THROUGH-SUBSTRATE INTERCONNECT
Publication number
20040018712
Publication date
Jan 29, 2004
Hubert Vander Plas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fluid ejector head having a planar passivation layer
Publication number
20040012653
Publication date
Jan 22, 2004
Kenneth E. Trueba
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
Droplet plate architecture
Publication number
20030011659
Publication date
Jan 16, 2003
Ravi Ramaswami
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS