Roslan Bin Said

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 11,239,128
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,431,513
- Issue date Oct 1, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices
- Patent number 9,640,458
- Issue date May 2, 2017
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices
- Patent number 8,823,159
- Issue date Sep 2, 2014
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing microelectronic devices
- Patent number 8,507,318
- Issue date Aug 13, 2013
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package for peripheral and center device pad layout device
- Patent number 8,269,328
- Issue date Sep 18, 2012
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package for peripheral and center device pad layout device
- Patent number 7,846,768
- Issue date Dec 7, 2010
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 7,557,443
- Issue date Jul 7, 2009
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package for peripheral and center device pad layout device
- Patent number 7,425,463
- Issue date Sep 16, 2008
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device package for peripheral and center device pad layout...
- Patent number 7,205,656
- Issue date Apr 17, 2007
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20190371693
- Publication date Dec 5, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20170301598
- Publication date Oct 19, 2017
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20150137364
- Publication date May 21, 2015
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20130292853
- Publication date Nov 7, 2013
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE
- Publication number 20110062583
- Publication date Mar 17, 2011
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20090239337
- Publication date Sep 24, 2009
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE
- Publication number 20080280396
- Publication date Nov 13, 2008
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic devices, stacked microelectronic devices, and metho...
- Publication number 20070045796
- Publication date Mar 1, 2007
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die package for peripheral and center device pad layout device
- Publication number 20060246622
- Publication date Nov 2, 2006
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked device package for peripheral and center device pad layout...
- Publication number 20060197206
- Publication date Sep 7, 2006
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS

Roslan Bin Said

Person

Patents Grantslast 30 patents

Microelectronic devices, stacked microelectronic devices, and metho...

Microelectronic devices, stacked microelectronic devices, and metho...

Stacked microelectronic devices

Stacked microelectronic devices

Method for manufacturing microelectronic devices

Stacked die package for peripheral and center device pad layout device

Stacked die package for peripheral and center device pad layout device

Microelectronic devices, stacked microelectronic devices, and metho...

Stacked die package for peripheral and center device pad layout device

Stacked device package for peripheral and center device pad layout...

Patents Applicationslast 30 patents

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE

Microelectronic devices, stacked microelectronic devices, and metho...

Stacked die package for peripheral and center device pad layout device

Stacked device package for peripheral and center device pad layout...