Roy Dale Hollaway

Person

Paranaque Metro Manila, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making near chip size integrated circuit package
- Patent number 6,962,829
- Issue date Nov 8, 2005
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin image sensor package
- Patent number 6,627,864
- Issue date Sep 30, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip image sensor package fabrication method
- Patent number 6,571,466
- Issue date Jun 3, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrally connected image sensor packages having a window support...
- Patent number 6,515,269
- Issue date Feb 4, 2003
- Amkor Technology, Inc.
- Steven Webster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for integrally connected image sensor packages h...
- Patent number 6,512,219
- Issue date Jan 28, 2003
- Amkor Technology, Inc.
- Steven Webster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin image sensor package fabrication method
- Patent number 6,396,043
- Issue date May 28, 2002
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-size semiconductor packages
- Patent number 6,291,884
- Issue date Sep 18, 2001
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having adhesive bead supporting planar l...
- Patent number 6,268,654
- Issue date Jul 31, 2001
- Ankor Technology, Inc.
- Thomas P. Glenn
- G11 - INFORMATION STORAGE
Information Patent Grant
Near chip size integrated circuit package
- Patent number 6,228,676
- Issue date May 8, 2001
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making integrated circuit package having adhesive bead su...
- Patent number 6,117,705
- Issue date Sep 12, 2000
- Amkor Technology, Inc.
- Thomas P. Glenn
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit package
- Patent number 6,034,429
- Issue date Mar 7, 2000
- Amkor Technology, Inc.
- Thomas P. Glenn
- G11 - INFORMATION STORAGE
Information Patent Grant
Near chip size integrated circuit package
- Patent number 5,981,314
- Issue date Nov 9, 1999
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball joint
- Patent number 5,796,163
- Issue date Aug 18, 1998
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interdigitated wirebond programmable fixed voltage planes
- Patent number 5,672,909
- Issue date Sep 30, 1997
- Amkor Electronics, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying flux to ball grid array package
- Patent number 5,482,736
- Issue date Jan 9, 1996
- Amkor Electronics, Inc.
- Thomas P. Glenn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Roy Dale Hollaway

Person

Patents Grantslast 30 patents

Method of making near chip size integrated circuit package

Thin image sensor package

Flip chip image sensor package fabrication method

Integrally connected image sensor packages having a window support...

Fabrication method for integrally connected image sensor packages h...

Thin image sensor package fabrication method

Chip-size semiconductor packages

Integrated circuit package having adhesive bead supporting planar l...

Near chip size integrated circuit package

Method of making integrated circuit package having adhesive bead su...

Integrated circuit package

Near chip size integrated circuit package

Solder ball joint

Interdigitated wirebond programmable fixed voltage planes

Method for applying flux to ball grid array package