Ru-Liang Lee

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-function substrate
- Patent number 12,113,071
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of metal-free SOI wafer
- Patent number 12,040,221
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 11,916,022
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transfer using substrate with etch stop layer and diffusi...
- Patent number 11,804,531
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-lateral recessed MIM structure
- Patent number 11,735,624
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having doped seed layer and method of manufact...
- Patent number 11,721,752
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer isolation structure for high voltage silicon-on-insulato...
- Patent number 11,682,578
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function substrate
- Patent number 11,532,642
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial semiconductor liner for enhancing uniformity of a charged...
- Patent number 11,404,465
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Ru-Liang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor with lateral protrusion structure
- Patent number 11,374,000
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Liang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 11,362,038
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having doped seed layer and method of manufact...
- Patent number 11,329,148
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of metal-free SOI wafer
- Patent number 11,232,974
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and formation thereof
- Patent number 11,167,982
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Yen Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Magnetic tunnel junction with reduced damage
- Patent number 11,145,806
- Issue date Oct 12, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,991,758
- Issue date Apr 27, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer debonding system and method
- Patent number 10,889,097
- Issue date Jan 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Chen Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming embedded nonvolatile memory
- Patent number 10,868,024
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure for flash memory cells and method of making...
- Patent number 10,811,504
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and formation thereof
- Patent number 10,683,204
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Yen Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Magnetic tunnel junction with reduced damage
- Patent number 10,672,975
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer debonding system and method
- Patent number 10,569,520
- Issue date Feb 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Chen Tsao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Embedded nonvolatile memory and forming method thereof
- Patent number 10,510,763
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniformity control for Si dot size in flash memory
- Patent number 10,497,560
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, transistor having doped seed layer and method...
- Patent number 10,483,386
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure for flash memory cells and method of making...
- Patent number 10,453,932
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and formation thereof
- Patent number 10,322,930
- Issue date Jun 18, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Yen Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure
- Patent number 10,304,903
- Issue date May 28, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split gate memory devices and methods of manufacturing
- Patent number 10,297,604
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RRAM cell bottom electrode formation
- Patent number 10,170,699
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Trinh Hai Dang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THIN FILM TRANSFER USING SUBSTRATE WITH ETCH STOP LAYER AND DIFFUSI...
- Publication number 20240379792
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING CHAMBER FOR METAL OXIDE REMOVAL
- Publication number 20240371685
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-LINE WAFER EDGE SEALING MONITORING SYSTEM AND METHODS OF OPERATION
- Publication number 20240371666
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF METAL-FREE SOI WAFER
- Publication number 20240347377
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTION SUBSTRATE
- Publication number 20240332306
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20240186258
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PIXEL SENSOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240120363
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chyi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOPED SEED LAYER AND METHOD OF MANUFACT...
- Publication number 20240021719
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Film Transfer Using Substrate with Etch Stop Layer and Diffusi...
- Publication number 20230369433
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LATERAL RECESSED MIM STRUCTURE
- Publication number 20230343817
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ISOLATION STRUCTURE FOR HIGH VOLTAGE SILICON-ON-INSULATO...
- Publication number 20230326787
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING CHAMBER FOR METAL OXIDE REMOVAL
- Publication number 20230062974
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTION SUBSTRATE
- Publication number 20220352211
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SEMICONDUCTOR LINER FOR ENHANCING UNIFORMITY OF A CHARGED...
- Publication number 20220328538
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Ru-Liang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20220328419
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MULTI-LATERAL RECESSED MIM STRUCTURE
- Publication number 20220285480
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTION SUBSTRATE
- Publication number 20220189997
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF METAL-FREE SOI WAFER
- Publication number 20220139769
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Isolation Structure for High Voltage Silicon-On-Insulato...
- Publication number 20220037199
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Film Transfer Using Substrate with Etch Stop Layer and Diffusi...
- Publication number 20220028994
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SEMICONDUCTOR LINER FOR ENHANCING UNIFORMITY OF A CHARGED...
- Publication number 20210391362
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Ru-Liang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20210375781
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR WITH LATERAL PROTRUSION STRUCUTRE
- Publication number 20210288047
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Ru-Liang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOPED SEED LAYER AND METHOD OF MANUFACT...
- Publication number 20210036140
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF
- Publication number 20200307993
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Yen Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Magnetic Tunnel Junction with Reduced Damage
- Publication number 20200295254
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF METAL-FREE SOI WAFER
- Publication number 20200176306
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING EMBEDDED NONVOLATILE MEMORY
- Publication number 20200119026
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DEBONDING SYSTEM AND METHOD
- Publication number 20200108592
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chang-Chen Tsao
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOPED SEED LAYER AND METHOD OF MANUFACT...
- Publication number 20200083362
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Ru-Liang Lee

Person

Patents Grantslast 30 patents

Multi-function substrate

Fabrication method of metal-free SOI wafer

Photolithography alignment process for bonded wafers

Thin film transfer using substrate with etch stop layer and diffusi...

Multi-lateral recessed MIM structure

Semiconductor device having doped seed layer and method of manufact...

Multilayer isolation structure for high voltage silicon-on-insulato...

Multi-function substrate

Epitaxial semiconductor liner for enhancing uniformity of a charged...

Trench capacitor with lateral protrusion structure

Photolithography alignment process for bonded wafers

Semiconductor device having doped seed layer and method of manufact...

Fabrication method of metal-free SOI wafer

Semiconductor arrangement and formation thereof

Magnetic tunnel junction with reduced damage

Semiconductor structure

Wafer debonding system and method

Method of forming embedded nonvolatile memory

Semiconductor structure for flash memory cells and method of making...

Semiconductor arrangement and formation thereof

Magnetic tunnel junction with reduced damage

Wafer debonding system and method

Embedded nonvolatile memory and forming method thereof

Uniformity control for Si dot size in flash memory

Semiconductor device, transistor having doped seed layer and method...

Semiconductor structure for flash memory cells and method of making...

Semiconductor arrangement and formation thereof

Semiconductor structure

Split gate memory devices and methods of manufacturing

RRAM cell bottom electrode formation

Patents Applicationslast 30 patents

THIN FILM TRANSFER USING SUBSTRATE WITH ETCH STOP LAYER AND DIFFUSI...

CLEANING CHAMBER FOR METAL OXIDE REMOVAL

IN-LINE WAFER EDGE SEALING MONITORING SYSTEM AND METHODS OF OPERATION

FABRICATION METHOD OF METAL-FREE SOI WAFER

MULTI-FUNCTION SUBSTRATE

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

PIXEL SENSOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE HAVING DOPED SEED LAYER AND METHOD OF MANUFACT...

Thin Film Transfer Using Substrate with Etch Stop Layer and Diffusi...

MULTI-LATERAL RECESSED MIM STRUCTURE

MULTILAYER ISOLATION STRUCTURE FOR HIGH VOLTAGE SILICON-ON-INSULATO...

CLEANING CHAMBER FOR METAL OXIDE REMOVAL

MULTI-FUNCTION SUBSTRATE

EPITAXIAL SEMICONDUCTOR LINER FOR ENHANCING UNIFORMITY OF A CHARGED...

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

MULTI-LATERAL RECESSED MIM STRUCTURE

MULTI-FUNCTION SUBSTRATE

FABRICATION METHOD OF METAL-FREE SOI WAFER

Multilayer Isolation Structure for High Voltage Silicon-On-Insulato...

Thin Film Transfer Using Substrate with Etch Stop Layer and Diffusi...

EPITAXIAL SEMICONDUCTOR LINER FOR ENHANCING UNIFORMITY OF A CHARGED...

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

TRENCH CAPACITOR WITH LATERAL PROTRUSION STRUCUTRE

SEMICONDUCTOR DEVICE HAVING DOPED SEED LAYER AND METHOD OF MANUFACT...

SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF

Magnetic Tunnel Junction with Reduced Damage

FABRICATION METHOD OF METAL-FREE SOI WAFER

METHOD OF FORMING EMBEDDED NONVOLATILE MEMORY

WAFER DEBONDING SYSTEM AND METHOD

SEMICONDUCTOR DEVICE HAVING DOPED SEED LAYER AND METHOD OF MANUFACT...