RU-YI CAI

Follow

Person

HSINCHU COUNTY, TW

People

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING PAC...
- Publication number 20250125276
- Publication date Apr 17, 2025
- AP MEMORY TECHNOLOGY CORPORATION
- RU-YI CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20250126811
- Publication date Apr 17, 2025
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STITCHING METHOD FOR EXPOSURE PROCESS
- Publication number 20250116941
- Publication date Apr 10, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240379623
- Publication date Nov 14, 2024
- AP MEMORY TECHNOLOGY CORPORATION
- WENLIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240055343
- Publication date Feb 15, 2024
- AP MEMORY TECHNOLOGY CORPORATION
- KEE-WEI CHUNG
- H01 - BASIC ELECTRIC ELEMENTS