Ru-Ying Huang

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Pad structure for enhanced bondability
- Patent number 11,996,368
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for enhanced bondability
- Patent number 11,728,279
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for enhanced bondability
- Patent number 11,227,836
- Issue date Jan 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structures of integrated circuits
- Patent number 10,453,818
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of packaging semiconductor devices
- Patent number 10,269,750
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of packaging semiconductor devices
- Patent number 9,659,890
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper bump joint structures with improved crack resistance
- Patent number 9,607,936
- Issue date Mar 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of packaging semiconductor devices
- Patent number 9,136,235
- Issue date Sep 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust joint structure for flip-chip bonding
- Patent number 8,847,387
- Issue date Sep 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of under bump metallization in packaging semi...
- Patent number 8,569,886
- Issue date Oct 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PAD STRUCTURE FOR ENHANCED BONDABILITY
- Publication number 20230343719
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE FOR ENHANCED BONDABILITY
- Publication number 20220139838
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE FOR ENHANCED BONDABILITY
- Publication number 20200126920
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structures of Integrated Circuits
- Publication number 20180151528
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20170256512
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20160005704
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20130127052
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structures of Integrated Circuits
- Publication number 20130087925
- Publication date Apr 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Bump Joint Structures with Improved Crack Resistance
- Publication number 20110101526
- Publication date May 5, 2011
- Ching-Wen Hsiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Robust Joint Structure for Flip-Chip Bonding
- Publication number 20110101519
- Publication date May 5, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Ru-Ying Huang

Person

Patents Grantslast 30 patents

Pad structure for enhanced bondability

Pad structure for enhanced bondability

Pad structure for enhanced bondability

Packaging structures of integrated circuits

Methods and apparatus of packaging semiconductor devices

Methods and apparatus of packaging semiconductor devices

Copper bump joint structures with improved crack resistance

Methods and apparatus of packaging semiconductor devices

Robust joint structure for flip-chip bonding

Methods and apparatus of under bump metallization in packaging semi...

Patents Applicationslast 30 patents

PAD STRUCTURE FOR ENHANCED BONDABILITY

PAD STRUCTURE FOR ENHANCED BONDABILITY

PAD STRUCTURE FOR ENHANCED BONDABILITY

Packaging Structures of Integrated Circuits

Methods and Apparatus of Packaging Semiconductor Devices

Methods and Apparatus of Packaging Semiconductor Devices

Methods and Apparatus of Packaging Semiconductor Devices

Packaging Structures of Integrated Circuits

Copper Bump Joint Structures with Improved Crack Resistance

Robust Joint Structure for Flip-Chip Bonding