Ruby Ann Merto Camenforte

Person

Mabalacat, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuits with conductive bumps having a profile with a w...
- Patent number 11,855,027
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Jose Daniel Carlos Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Siderail with mold compound relief
- Patent number 10,964,629
- Issue date Mar 30, 2021
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with conductive bumps having a profile with a w...
- Patent number 10,847,483
- Issue date Nov 24, 2020
- Texas Instruments Incorporated
- Jose Daniel Carlos Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe strip assembly and method of processing
- Patent number 9,698,085
- Issue date Jul 4, 2017
- Texas Instruments Incorporated
- Rex Araneta Cari-an
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS
- Publication number 20250006607
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240404973
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mohamad Ashraf bin Mohd Arshad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TOOL AND MULTI-DIRECTIONAL PACKAGE SINGULATION
- Publication number 20240222144
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK ARREST FEATURES FOR MIULTILEVEL PACKAGE SUBSTRATE
- Publication number 20240063107
- Publication date Feb 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jason Colte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT FOR IC PACKAGE
- Publication number 20230170285
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Merto Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CONDUCTIVE BUMPS HAVING A PROFILE WITH A W...
- Publication number 20210082851
- Publication date Mar 18, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jose Daniel Carlos TORRES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDERAIL WITH MOLD COMPOUND RELIEF
- Publication number 20200235043
- Publication date Jul 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CONDUCTIVE BUMPS HAVING A PROFILE WITH A W...
- Publication number 20200075523
- Publication date Mar 5, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jose Daniel Carlos TORRES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME STRIP ASSEMBLY AND METHOD OF PROCESSING
- Publication number 20170179008
- Publication date Jun 22, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Rex Araneta Cari-an
- H01 - BASIC ELECTRIC ELEMENTS

Ruby Ann Merto Camenforte

Person

Patents Grantslast 30 patents

Integrated circuits with conductive bumps having a profile with a w...

Siderail with mold compound relief

Integrated circuits with conductive bumps having a profile with a w...

Leadframe strip assembly and method of processing

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS

WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE

MULTI-TOOL AND MULTI-DIRECTIONAL PACKAGE SINGULATION

CRACK ARREST FEATURES FOR MIULTILEVEL PACKAGE SUBSTRATE

INTERCONNECT FOR IC PACKAGE

INTEGRATED CIRCUITS WITH CONDUCTIVE BUMPS HAVING A PROFILE WITH A W...

SIDERAIL WITH MOLD COMPOUND RELIEF

INTEGRATED CIRCUITS WITH CONDUCTIVE BUMPS HAVING A PROFILE WITH A W...

LEADFRAME STRIP ASSEMBLY AND METHOD OF PROCESSING