Membership
Tour
Register
Log in
Ruey-Yun Shiue
Follow
Person
Hsin-Chu, TW
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Two step molding grinding for packaging applications
Patent number
9,209,048
Issue date
Dec 8, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Chun Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding pad structure to minimize IMD cracking
Patent number
7,759,797
Issue date
Jul 20, 2010
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Top via pattern for bond pad structure
Patent number
7,323,784
Issue date
Jan 29, 2008
Taiwan Semiconductor Manufacturing Co., Ltd.
Ho-Yin Yiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding pad structure to minimize IMD cracking
Patent number
7,135,395
Issue date
Nov 14, 2006
Taiwan Semiconductor Manufacturing Co.
Chung Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mesh pad structure to eliminate IMD crack on pad
Patent number
6,875,682
Issue date
Apr 5, 2005
Taiwan Semiconductor Manufacturing Company
Chung Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ion mixing between two-step titanium deposition process for titaniu...
Patent number
6,451,679
Issue date
Sep 17, 2002
Taiwan Semiconductor Manufacturing Company
Chu-Wei Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual damascene process flow for a deep sub-micron technology
Patent number
6,211,069
Issue date
Apr 3, 2001
Taiwan Semiconductor Manufacturing Company
Chu-Wei Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for making metal capacitors for deep submicrometer processes...
Patent number
6,140,693
Issue date
Oct 31, 2000
Taiwan Semiconductor Manufacturing Company
Jiue Wen Weng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
ESD implantation scheme for 0.35 .mu.m 3.3V 70A gate oxide process
Patent number
5,953,601
Issue date
Sep 14, 1999
Taiwan Semiconductor Manufacturing Company, Ltd.
Ruey-Yun Shiue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for making metal capacitors for deep submicrometer processes...
Patent number
5,946,567
Issue date
Aug 31, 1999
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiue Wen Weng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad structure for the via plug process
Patent number
5,923,088
Issue date
Jul 13, 1999
Taiwan Semiconductor Manufacturing Company, Ltd.
Ruey-Yun Shiue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plasma damage monitor
Patent number
5,781,445
Issue date
Jul 14, 1998
Taiwan Semiconductor Manufacturing Company, Ltd.
Ruey-Yun Shiue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming bond pad structure for the via plug process
Patent number
5,700,735
Issue date
Dec 23, 1997
Taiwan Semiconductor Manufacturing Company, Ltd.
Ruey-Yun Shiue
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
TWO STEP MOLDING GRINDING FOR PACKAGING APPLICATIONS
Publication number
20150187607
Publication date
Jul 2, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Chun Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Novel bonding pad structure to minimize IMD cracking
Publication number
20070035038
Publication date
Feb 15, 2007
Chung Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Top via pattern for bond pad structure
Publication number
20060208360
Publication date
Sep 21, 2006
Taiwan Semiconductor Manufacturing Co., Ltd.
Ho-Yin Yiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Novel bonding pad structure to minimize IMD cracking
Publication number
20050064693
Publication date
Mar 24, 2005
Chung Liu
H01 - BASIC ELECTRIC ELEMENTS