Rui Niu

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Beijing, CN

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Patents Grantslast 30 patents

Information Patent Grant
Multi-tier IC package including processor and high bandwidth memory
- Patent number 12,154,890
- Issue date Nov 26, 2024
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for a substrate core layer
- Patent number 10,212,818
- Issue date Feb 19, 2019
- FutureWei Technologies, Inc.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-SIDE POWER DELIVERY IN STACKED MEMORY PACKAGING
- Publication number 20220189901
- Publication date Jun 16, 2022
- Huawei Technologies Co., Ltd
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Tier Processor/Memory Package
- Publication number 20210358894
- Publication date Nov 18, 2021
- Huawei Technologies Co., Ltd
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for a Substrate Core Layer
- Publication number 20180288880
- Publication date Oct 4, 2018
- FutureWei Technologies, Inc.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS