Ruisheng Wu

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Substrateless power device packages
- Patent number 9,136,154
- Issue date Sep 15, 2015
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless power device packages
- Patent number 8,987,878
- Issue date Mar 24, 2015
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging method of encapsulating the bottom and side o...
- Patent number 8,486,803
- Issue date Jul 16, 2013
- Alpha & Omega Semiconductor, Inc.
- Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package and method of laser marking the same
- Patent number 7,842,543
- Issue date Nov 30, 2010
- Alpha and Omega Semiconductor Incorporated
- Ruisheng Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATELESS POWER DEVICE PACKAGES
- Publication number 20150340301
- Publication date Nov 26, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATELESS POWER DEVICE PACKAGES
- Publication number 20150056752
- Publication date Feb 26, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING METHOD OF ENCAPSULATING THE BOTTOM AND SIDE O...
- Publication number 20130095612
- Publication date Apr 18, 2013
- Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSP
- Publication number 20120142165
- Publication date Jun 7, 2012
- Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATELESS POWER DEVICE PACKAGES
- Publication number 20120104580
- Publication date May 3, 2012
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE PROCESS WITH IMPROVED DIE ATTACH METHOD FOR U...
- Publication number 20110294262
- Publication date Dec 1, 2011
- Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated Gate Bipolar Transistor (IGBT) Collector Formed with Ge/A...
- Publication number 20100327314
- Publication date Dec 30, 2010
- Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level chip scale package and method of laser marking the same
- Publication number 20100207283
- Publication date Aug 19, 2010
- Ruisheng Wu
- H01 - BASIC ELECTRIC ELEMENTS

Ruisheng Wu

Person

Patents Grantslast 30 patents

Substrateless power device packages

Substrateless power device packages

Wafer level packaging method of encapsulating the bottom and side o...

Wafer level chip scale package and method of laser marking the same

Patents Applicationslast 30 patents

SUBSTRATELESS POWER DEVICE PACKAGES

SUBSTRATELESS POWER DEVICE PACKAGES

WAFER LEVEL PACKAGING METHOD OF ENCAPSULATING THE BOTTOM AND SIDE O...

Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSP

SUBSTRATELESS POWER DEVICE PACKAGES

SEMICONDUCTOR PACKAGE PROCESS WITH IMPROVED DIE ATTACH METHOD FOR U...

Insulated Gate Bipolar Transistor (IGBT) Collector Formed with Ge/A...

Wafer level chip scale package and method of laser marking the same