Rung-De Wang

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,276,514
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondcutor structure and semiconductor manufacturing process the...
- Patent number 9,837,366
- Issue date Dec 5, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hsun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Improving the strength of micro-bump joints
- Patent number 9,768,138
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strength of micro-bump joints
- Patent number 9,219,046
- Issue date Dec 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Strength of micro-bump joints
- Patent number 8,901,736
- Issue date Dec 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20190371741
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190131251
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Improving the Strength of Micro-Bump Joints
- Publication number 20160104685
- Publication date Apr 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Strength of Micro-Bump Joints
- Publication number 20150037936
- Publication date Feb 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Strength of Micro-Bump Joints
- Publication number 20110291262
- Publication date Dec 1, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS