Russell K. Mortensen

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,798,932
- Issue date Oct 24, 2023
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 10,607,976
- Issue date Mar 31, 2020
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic die and other components embedded in build-up layers
- Patent number 10,453,799
- Issue date Oct 22, 2019
- Intel Corporation
- Deepak V. Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 10,446,530
- Issue date Oct 15, 2019
- Intel Corporation
- Russell K. Mortensen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Logic die and other components embedded in build-up layers
- Patent number 9,496,211
- Issue date Nov 15, 2016
- Intel Corporation
- Deepak V. Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240222350
- Publication date Jul 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240006401
- Publication date Jan 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE
- Publication number 20230089096
- Publication date Mar 23, 2023
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220344318
- Publication date Oct 27, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220157799
- Publication date May 19, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH REDUCED THROUGH-SUBSTRATE ROUTING
- Publication number 20210296241
- Publication date Sep 23, 2021
- Intel Corporation
- Arghya Sain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20200251462
- Publication date Aug 6, 2020
- Intel Corporation
- Russell Mortensen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOGIC DIE AND OTHER COMPONENTS EMBEDDED IN BUILD-UP LAYERS
- Publication number 20170125351
- Publication date May 4, 2017
- Intel Corporation
- Deepak V. Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20160218093
- Publication date Jul 28, 2016
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20160133557
- Publication date May 12, 2016
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DIE AND OTHER COMPONENTS EMBEDDED IN BUILD-UP LAYERS
- Publication number 20140138845
- Publication date May 22, 2014
- Deepak V. Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20130271907
- Publication date Oct 17, 2013
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATE, METHOD OF MANUFACTURING SAME, AND PACKAGE FOR M...
- Publication number 20120005887
- Publication date Jan 12, 2012
- Russell Mortensen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Coreless substrate, method of manufacturing same, and package for m...
- Publication number 20100073894
- Publication date Mar 25, 2010
- Russell Mortensen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Russell K. Mortensen

Person

Patents Grantslast 30 patents

Offset interposers for large-bottom packages and large-die package-...

Offset interposers for large-bottom packages and large-die package-...

Offset interposers for large-bottom packages and large-die package-...

Offset interposers for large-bottom packages and large-die package-...

Logic die and other components embedded in build-up layers

Offset interposers for large-bottom packages and large-die package-...

Logic die and other components embedded in build-up layers

Patents Applicationslast 30 patents

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

MICROELECTRONIC PACKAGE WITH REDUCED THROUGH-SUBSTRATE ROUTING

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

LOGIC DIE AND OTHER COMPONENTS EMBEDDED IN BUILD-UP LAYERS

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

LOGIC DIE AND OTHER COMPONENTS EMBEDDED IN BUILD-UP LAYERS

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

CORELESS SUBSTRATE, METHOD OF MANUFACTURING SAME, AND PACKAGE FOR M...

Coreless substrate, method of manufacturing same, and package for m...