Ryan John Lewis

Person

  • Boulder, CO, US

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    THERMAL MANAGEMENT PLANES

    • Publication number 20240369306
    • Publication date Nov 7, 2024
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan J. Lewis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Deformed Mesh Thermal Ground Plane

    • Publication number 20230392875
    • Publication date Dec 7, 2023
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan Lewis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    MICROPILLAR-ENABLED THERMAL GROUND PLANE

    • Publication number 20230332841
    • Publication date Oct 19, 2023
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan John Lewis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Folding Thermal Ground Plane

    • Publication number 20230292466
    • Publication date Sep 14, 2023
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan J. Lewis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Phone Case with Thermal Ground Plane

    • Publication number 20230096345
    • Publication date Mar 30, 2023
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan J. Lewis
    • A45 - HAND OR TRAVELLING ARTICLES
  • Information Patent Application

    THERMAL MANAGEMENT PLANES

    • Publication number 20220163268
    • Publication date May 26, 2022
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan J. Lewis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE

    • Publication number 20220155025
    • Publication date May 19, 2022
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan John Lewis
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    THERMAL MANAGEMENT PLANES

    • Publication number 20220074673
    • Publication date Mar 10, 2022
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan J. Lewis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Folding Thermal Ground Plane

    • Publication number 20210400846
    • Publication date Dec 23, 2021
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan J. Lewis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Deformed Mesh Thermal Ground Plane

    • Publication number 20210293488
    • Publication date Sep 23, 2021
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan Lewis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    VAPOR CHAMBER, HEATSINK DEVICE, AND ELECTRONIC DEVICE

    • Publication number 20210136955
    • Publication date May 6, 2021
    • Murata Manufacturing Co., Ltd.
    • TAKUO WAKAOKA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    MICROPILLAR-ENABLED THERMAL GROUND PLANE

    • Publication number 20200300563
    • Publication date Sep 24, 2020
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan John Lewis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    VAPOR CHAMBER

    • Publication number 20200182557
    • Publication date Jun 11, 2020
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan John Lewis
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE

    • Publication number 20190390919
    • Publication date Dec 26, 2019
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan John Lewis
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    THERMAL MANAGEMENT PLANES

    • Publication number 20180320984
    • Publication date Nov 8, 2018
    • Ryan J. Lewis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    METHOD AND DEVICE FOR SPREADING HIGH HEAT FLUXES IN THERMAL GROUND...

    • Publication number 20180128553
    • Publication date May 10, 2018
    • Ryan John Lewis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    METHOD AND DEVICE FOR OPTIMIZATION OF VAPOR TRANSPORT IN A THERMAL...

    • Publication number 20180106554
    • Publication date Apr 19, 2018
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • RYAN JOHN LEWIS
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE

    • Publication number 20160161193
    • Publication date Jun 9, 2016
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan John Lewis
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    MICROPILLAR-ENABLED THERMAL GROUND PLANE

    • Publication number 20160076820
    • Publication date Mar 17, 2016
    • The Regents of the University of Colorado, a Body Corporate
    • Ryan John Lewis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    VACUUM-ENHANCED HEAT SPREADER

    • Publication number 20160081227
    • Publication date Mar 17, 2016
    • The Regents of the University of Colorado, a Body Corporate
    • Yung-Cheng Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR