Ryan Lei

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Germanium on insulator fabrication via epitaxial germanium bonding
- Patent number 7,279,369
- Issue date Oct 9, 2007
- Intel Corporation
- Ryan Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complete device layer transfer without edge exclusion via direct wa...
- Patent number 7,161,224
- Issue date Jan 9, 2007
- Intel Corporation
- Peter Tolchinsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding of substrates
- Patent number 7,148,122
- Issue date Dec 12, 2006
- Intel Corporation
- Mohamad A. Shaheen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complete device layer transfer without edge exclusion via direct wa...
- Patent number 6,908,027
- Issue date Jun 21, 2005
- Intel Corporation
- Peter Tolchinsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature germanium transfer
- Patent number 6,833,195
- Issue date Dec 21, 2004
- Intel Corporation
- Ryan Lei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Layer transfer technique
- Publication number 20060286771
- Publication date Dec 21, 2006
- Mohamad Shaheen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Germanium-on-insulator fabrication utilizing wafer bonding
- Publication number 20060049399
- Publication date Mar 9, 2006
- Ryan Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding of substrates
- Publication number 20060043483
- Publication date Mar 2, 2006
- Mohamad A. Shaheen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Germanium-on-insulator fabrication utilizing wafer bonding
- Publication number 20060046488
- Publication date Mar 2, 2006
- Ryan Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Strained silicon with reduced roughness
- Publication number 20050211982
- Publication date Sep 29, 2005
- Ryan Lei
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Complete device layer transfer without edge exclusion via direct wa...
- Publication number 20050173781
- Publication date Aug 11, 2005
- Peter Tolchinsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Germanium-on-insulator fabrication utilizing wafer bonding
- Publication number 20050067377
- Publication date Mar 31, 2005
- Ryan Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Germanium on insulator fabrication via epitaxial germanium bonding
- Publication number 20050042842
- Publication date Feb 24, 2005
- Ryan Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layer transfer technique
- Publication number 20040262686
- Publication date Dec 30, 2004
- Mohamad Shaheen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Complete device layer transfer without edge exclusion via direct wa...
- Publication number 20040188501
- Publication date Sep 30, 2004
- Peter Tolchinsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Germanium on insulator fabrication via epitaxial germanium bonding

Complete device layer transfer without edge exclusion via direct wa...

Bonding of substrates

Complete device layer transfer without edge exclusion via direct wa...

Low temperature germanium transfer

Patents Applicationslast 30 patents

Layer transfer technique

Germanium-on-insulator fabrication utilizing wafer bonding

Bonding of substrates

Germanium-on-insulator fabrication utilizing wafer bonding

Strained silicon with reduced roughness

Complete device layer transfer without edge exclusion via direct wa...

Germanium-on-insulator fabrication utilizing wafer bonding

Germanium on insulator fabrication via epitaxial germanium bonding

Layer transfer technique

Complete device layer transfer without edge exclusion via direct wa...