Ryan W. Rieger

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vertical sensor assembly method
- Patent number 8,703,543
- Issue date Apr 22, 2014
- Honeywell International Inc.
- Hong Wan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for three dimensional sensors
- Patent number 8,459,112
- Issue date Jun 11, 2013
- Honeywell International Inc.
- Ryan W. Rieger
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for three-axis sensor chip packages
- Patent number 8,316,552
- Issue date Nov 27, 2012
- Honeywell International Inc.
- Lakshman Withanawasam
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated 3-axis field sensor and fabrication methods
- Patent number 7,564,237
- Issue date Jul 21, 2009
- Honeywell International Inc.
- Ryan W. Rieger
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for linear positioning
- Patent number 7,355,389
- Issue date Apr 8, 2008
- Honeywell International, Inc.
- Ryan W. Rieger
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR THREE DIMENSIONAL SENSORS
- Publication number 20120313193
- Publication date Dec 13, 2012
- Honeywell International Inc.
- Ryan W. Rieger
- G01 - MEASURING TESTING
Information Patent Application
THREE-AXIS MAGNETIC SENSORS
- Publication number 20120299587
- Publication date Nov 29, 2012
- Honeywell International Inc.
- Ryan W. Rieger
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR THREE-AXIS SENSOR CHIP PACKAGES
- Publication number 20120279077
- Publication date Nov 8, 2012
- Honeywell International Inc.
- Lakshman Withanawasam
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICAL SENSOR ASSEMBLY METHOD
- Publication number 20110012213
- Publication date Jan 20, 2011
- Honeywell International Inc.
- Hong Wan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED 3-AXIS FIELD SENSOR AND FABRICATION METHODS
- Publication number 20090102475
- Publication date Apr 23, 2009
- Honeywell International Inc.
- Ryan W. Rieger
- G01 - MEASURING TESTING
Information Patent Application
3D INTEGRATED COMPASS PACKAGE
- Publication number 20090072823
- Publication date Mar 19, 2009
- Honeywell International Inc.
- Hong Wan
- G01 - MEASURING TESTING
Information Patent Application
Method and system for linear positioning
- Publication number 20070096723
- Publication date May 3, 2007
- Honeywell International Inc.
- Ryan W. Rieger
- G01 - MEASURING TESTING

Ryan W. Rieger

Person

Patents Grantslast 30 patents

Vertical sensor assembly method

Systems and methods for three dimensional sensors

Systems and methods for three-axis sensor chip packages

Integrated 3-axis field sensor and fabrication methods

Method and system for linear positioning

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR THREE DIMENSIONAL SENSORS

THREE-AXIS MAGNETIC SENSORS

SYSTEMS AND METHODS FOR THREE-AXIS SENSOR CHIP PACKAGES

VERTICAL SENSOR ASSEMBLY METHOD

INTEGRATED 3-AXIS FIELD SENSOR AND FABRICATION METHODS

3D INTEGRATED COMPASS PACKAGE

Method and system for linear positioning