Ryo Kanai

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board, crack prediction device, and crack prediction...
- Patent number 10,605,851
- Issue date Mar 31, 2020
- Fujitsu Limited
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, crack prediction device, and crack prediction...
- Patent number 9,709,619
- Issue date Jul 18, 2017
- Fujitsu Limited
- Shigeo Iriguchi
- G01 - MEASURING TESTING
Information Patent Grant
Substrate with embedded component
- Patent number 9,591,763
- Issue date Mar 7, 2017
- Fujitsu Limited
- Mitsunori Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed board
- Patent number 9,295,155
- Issue date Mar 22, 2016
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board reliably achieving electric connection with el...
- Patent number 8,305,767
- Issue date Nov 6, 2012
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed board
- Patent number 8,269,114
- Issue date Sep 18, 2012
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board reliably achieving electric connection with el...
- Patent number 8,233,286
- Issue date Jul 31, 2012
- Fujitsu Limited
- Naoki Nakamura

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...
- Publication number 20170285096
- Publication date Oct 5, 2017
- Fujitsu Limited
- Shigeo IRIGUCHI
- G01 - MEASURING TESTING
Information Patent Application
RIGID FLEXIBLE BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170196077
- Publication date Jul 6, 2017
- Fujitsu Limited
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH EMBEDDED COMPONENT
- Publication number 20160324005
- Publication date Nov 3, 2016
- Fujitsu Limited
- Mitsunori Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...
- Publication number 20140077834
- Publication date Mar 20, 2014
- Shigeo IRIGUCHI
- G01 - MEASURING TESTING
Information Patent Application
FLEXIBLE PRINTED BOARD
- Publication number 20120312586
- Publication date Dec 13, 2012
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD USING FLEXIBLE INTERCONNECT STRUCT...
- Publication number 20110286188
- Publication date Nov 24, 2011
- Fujitsu Limited
- Ryo KANAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME...
- Publication number 20110132654
- Publication date Jun 9, 2011
- Fujitsu Limited
- Nobuo TAKETOMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED BOARD
- Publication number 20100212938
- Publication date Aug 26, 2010
- FUJITSU LIMITED
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and printed circuit board unit and electronic...
- Publication number 20090139750
- Publication date Jun 4, 2009
- FUJITSU LIMITED
- Ryo Kanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board reliably achieving electric connection with el...
- Publication number 20080080153
- Publication date Apr 3, 2008
- FUJITSU LIMITED
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board assembly and manufacturing method thereof, electronic...
- Publication number 20080066953
- Publication date Mar 20, 2008
- FUJITSU LIMITED
- Ryo Kanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Printed wiring board, crack prediction device, and crack prediction...

Printed wiring board, crack prediction device, and crack prediction...

Substrate with embedded component

Flexible printed board

Printed wiring board reliably achieving electric connection with el...

Flexible printed board

Printed wiring board reliably achieving electric connection with el...

Patents Applicationslast 30 patents

PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...

RIGID FLEXIBLE BOARD AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE WITH EMBEDDED COMPONENT

PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...

FLEXIBLE PRINTED BOARD

MULTILAYER PRINTED CIRCUIT BOARD USING FLEXIBLE INTERCONNECT STRUCT...

MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME...

FLEXIBLE PRINTED BOARD

Printed wiring board and printed circuit board unit and electronic...

Printed wiring board reliably achieving electric connection with el...

Circuit board assembly and manufacturing method thereof, electronic...