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Ryohei Yumoto
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Saitama-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
Patent number
11,908,768
Issue date
Feb 20, 2024
Mitsubishi Materials Corporation
Ryohei Yumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power-module substrate with heat-sink
Patent number
11,462,456
Issue date
Oct 4, 2022
Mitsubishi Materials Corporation
Ryohei Yumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Insulation circuit board with heat sink
Patent number
11,322,424
Issue date
May 3, 2022
Mitsubishi Materials Corporation
Ryohei Yumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power-module substrate with heat-sink
Patent number
11,302,602
Issue date
Apr 12, 2022
Mitsubishi Materials Corporation
Ryohei Yumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Insulation circuit board with heat sink
Patent number
11,289,390
Issue date
Mar 29, 2022
Mitsubishi Materials Corporation
Ryohei Yumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
Patent number
11,289,400
Issue date
Mar 29, 2022
Mitsubishi Materials Corporation
Ryohei Yumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Insulated circuit board
Patent number
11,013,107
Issue date
May 18, 2021
Mitsubishi Materials Corporation
Takeshi Kitahara
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING I...
Publication number
20230115820
Publication date
Apr 13, 2023
MITSUBISHI MATERIALS CORPORATION
Ryohei Yumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INSULATION CIRCUIT BOARD WITH HEAT SINK
Publication number
20220223493
Publication date
Jul 14, 2022
MITSUBISHI MATERIALS CORPORATION
Ryohei Yumoto
B32 - LAYERED PRODUCTS
Information
Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
Publication number
20220173010
Publication date
Jun 2, 2022
MITSUBISHI MATERIALS CORPORATION
Ryohei Yumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER-MODULE SUBSTRATE WITH HEAT-SINK
Publication number
20210296204
Publication date
Sep 23, 2021
MITSUBISHI MATERIALS CORPORATION
Ryohei Yumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INSULATION CIRCUIT BOARD WITH HEAT SINK
Publication number
20210118769
Publication date
Apr 22, 2021
MITSUBISHI MATERIALS CORPORATION
Ryohei YUMOTO
B32 - LAYERED PRODUCTS
Information
Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
Publication number
20210028086
Publication date
Jan 28, 2021
MITSUBISHI MATERIALS CORPORATION
Ryohei Yumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INSULATION CIRCUIT BOARD WITH HEAT SINK
Publication number
20210020530
Publication date
Jan 21, 2021
MITSUBISHI MATERIALS CORPORATION
Ryohei Yumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INSULATED CIRCUIT BOARD
Publication number
20210007217
Publication date
Jan 7, 2021
MITSUBISHI MATERIALS CORPORATION
Takeshi Kitahara
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
POWER-MODULE SUBSTRATE WITH HEAT-SINK
Publication number
20200027815
Publication date
Jan 23, 2020
MITSUBISHI MATERIALS CORPORATION
Ryohei Yumoto
H01 - BASIC ELECTRIC ELEMENTS