Ryoji Matsushima

Person

Yokkaichi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Transfer molding method with sensor and shut-off pin
- Patent number 11,605,548
- Issue date Mar 14, 2023
- Kioxia Corporation
- Takeori Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold and transfer molding apparatus
- Patent number 11,114,322
- Issue date Sep 7, 2021
- TOSHIBA MEMORY CORPORATION
- Takeori Maeda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mold
- Patent number 10,896,825
- Issue date Jan 19, 2021
- TOSHIBA MEMORY CORPORATION
- Takeori Maeda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mold device
- Patent number 10,262,879
- Issue date Apr 16, 2019
- TOSHIBA MEMORY CORPORATION
- Takeori Maeda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 9,997,484
- Issue date Jun 12, 2018
- TOSHIBA MEMORY CORPORATION
- Takeori Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing same, and semiconduc...
- Patent number 8,749,031
- Issue date Jun 10, 2014
- Kabushiki Kaisha Toshiba
- Ryoji Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and manufacturing method thereof
- Patent number 8,603,865
- Issue date Dec 10, 2013
- Kabushiki Kaisha Toshiba
- Ryoji Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and manufacturing method thereof
- Patent number 8,492,885
- Issue date Jul 23, 2013
- Kabushiki Kaisha Toshiba
- Ryoji Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and manufacturing method thereof
- Patent number 8,269,325
- Issue date Sep 18, 2012
- Kabushiki Kaisha Toshiba
- Ryoji Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and semiconductor memory device
- Patent number 7,968,993
- Issue date Jun 28, 2011
- Kabushiki Kaisha Toshiba
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and semiconductor device
- Patent number 7,911,045
- Issue date Mar 22, 2011
- Kabushiki Kaisha Toshiba
- Ryoji Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module using the same
- Patent number 7,763,964
- Issue date Jul 27, 2010
- Kabushiki Kaisha Toshiba
- Ryoji Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stack chip package with wired bonded chips
- Patent number 7,755,175
- Issue date Jul 13, 2010
- Kabushiki Kaisha Toshiba
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile semiconductor package
- Patent number 7,598,604
- Issue date Oct 6, 2009
- Kabushiki Kaisha Toshiba
- Ryoji Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,569,921
- Issue date Aug 4, 2009
- Kabushiki Kaisha Toshiba
- Noboru Okane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLD AND TRANSFER MOLDING APPARATUS
- Publication number 20210366748
- Publication date Nov 25, 2021
- Toshiba Memory Corporation
- Takeori MAEDA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOLD
- Publication number 20180254198
- Publication date Sep 6, 2018
- Toshiba Memory Corporation
- Takeori MAEDA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOLD AND TRANSFER MOLDING APPARATUS
- Publication number 20170271186
- Publication date Sep 21, 2017
- KABUSHIKI KAISHA TOSHIBA
- TAKEORI MAEDA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOLD DEVICE
- Publication number 20170263476
- Publication date Sep 14, 2017
- Kabushiki Kaisha Toshiba
- Takeori Maeda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20170263582
- Publication date Sep 14, 2017
- Kabushiki Kaisha Toshiba
- Takeori MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120319257
- Publication date Dec 20, 2012
- Kabushiki Kaisha Toshiba
- Ryoji MATSUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUC...
- Publication number 20120049331
- Publication date Mar 1, 2012
- KABUSHIKI KAISHA TOSHIBA
- Ryoji MATSUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110198740
- Publication date Aug 18, 2011
- Kabushiki Kaisha Toshiba
- Ryoji MATSUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100255637
- Publication date Oct 7, 2010
- KABUSHIKI KAISHA TOSHIBA
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20090045525
- Publication date Feb 19, 2009
- Kabushiki Kaisha Toshiba
- Ryoji MATSUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090032972
- Publication date Feb 5, 2009
- Kabushiki Kaisha Toshiba
- Tadanobu OKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE
- Publication number 20090014894
- Publication date Jan 15, 2009
- Kabushiki Kaisha Toshiba
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE AND CIRCUIT DEVICE...
- Publication number 20070102762
- Publication date May 10, 2007
- KABUSHIKI KAISHA TOSHIBA
- Ryoji Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070102801
- Publication date May 10, 2007
- Kabushiki Kaisha Toshiba
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and manufacturing method thereof
- Publication number 20070023875
- Publication date Feb 1, 2007
- KABUSHIKI KAISHA TOSHIBA
- Noboru Okane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20070023922
- Publication date Feb 1, 2007
- KABUSHIKI KAISHA TOSHIBA
- Noboru Okane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060232288
- Publication date Oct 19, 2006
- KABUSHIKI KAISHA TOSHIBA
- Noboru Okane
- H01 - BASIC ELECTRIC ELEMENTS

Ryoji Matsushima

Person

Patents Grantslast 30 patents

Transfer molding method with sensor and shut-off pin

Mold and transfer molding apparatus

Mold

Mold device

Semiconductor device and manufacturing method of the same

Semiconductor device, method for manufacturing same, and semiconduc...

Semiconductor storage device and manufacturing method thereof

Semiconductor storage device and manufacturing method thereof

Semiconductor storage device and manufacturing method thereof

Stacked semiconductor device and semiconductor memory device

Semiconductor element and semiconductor device

Semiconductor device and semiconductor module using the same

Multi-stack chip package with wired bonded chips

Low profile semiconductor package

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

MOLD AND TRANSFER MOLDING APPARATUS

MOLD

MOLD AND TRANSFER MOLDING APPARATUS

MOLD DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUC...

SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF

STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE AND CIRCUIT DEVICE...

STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package and manufacturing method thereof

Semiconductor package

Semiconductor device and manufacturing method thereof