Ryojiro TOMINAGA

Person

Okazaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Image processing device, image processing method, and computer read...
- Patent number 12,151,438
- Issue date Nov 26, 2024
- FUJI CORPORATION
- Ryojiro Tominaga
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing stack components
- Patent number 12,119,327
- Issue date Oct 15, 2024
- FUJI CORPORATION
- Ryojiro Tominaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring formation method
- Patent number 12,096,570
- Issue date Sep 17, 2024
- FUJI CORPORATION
- Ryojiro Tominaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit production method using 3D layer shaping
- Patent number 12,048,102
- Issue date Jul 23, 2024
- FUJI CORPORATION
- Ryojiro Tominaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cured resin formation method and cured resin formation device
- Patent number 11,945,886
- Issue date Apr 2, 2024
- FUJI CORPORATION
- Tasuku Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit formation method
- Patent number 11,849,545
- Issue date Dec 19, 2023
- FUJI CORPORATION
- Kenji Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed substrate forming method
- Patent number 11,540,397
- Issue date Dec 27, 2022
- FUJI CORPORATION
- Ryojiro Tominaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional multi-layer electronic device production method
- Patent number 11,458,722
- Issue date Oct 4, 2022
- FUJI CORPORATION
- Ryojiro Tominaga
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT FORMING METHOD AND INFORMATION PROCESSING DEVICE
- Publication number 20240390985
- Publication date Nov 28, 2024
- FUJI CORPORATION
- Ryojiro TOMINAGA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CIRCUIT FORMING METHOD
- Publication number 20240023249
- Publication date Jan 18, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD AND PRODUCTION DEVICE FOR THREE-DIMENSIONALLY FAB...
- Publication number 20230405935
- Publication date Dec 21, 2023
- FUJI CORPORATION
- Ryojiro TOMINAGA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WIRING FORMATION METHOD
- Publication number 20230112913
- Publication date Apr 13, 2023
- FUJI CORPORATION
- Ryojiro TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE PROCESSING DEVICE, IMAGE PROCESSING METHOD, AND PROGRAM
- Publication number 20220332052
- Publication date Oct 20, 2022
- FUJI CORPORATION
- Ryojiro TOMINAGA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CURED RESIN FORMATION METHOD AND CURED RESIN FORMATION DEVICE
- Publication number 20220298267
- Publication date Sep 22, 2022
- FUJI CORPORATION
- Tasuku TAKEUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT WIRING BY THREE-DIMENSIONAL ADDITI...
- Publication number 20220279658
- Publication date Sep 1, 2022
- FUJI CORPORATION
- Ryojiro TOMINAGA
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
ELECTRONIC CIRCUIT PRODUCTION METHOD USING 3D LAYER SHAPING
- Publication number 20220279657
- Publication date Sep 1, 2022
- FUJI CORPORATION
- Ryojiro TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING STACK COMPONENTS
- Publication number 20220271010
- Publication date Aug 25, 2022
- FUJI CORPORATION
- Ryojiro TOMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MOLDING MACHINE
- Publication number 20220264777
- Publication date Aug 18, 2022
- FUJI CORPORATION
- Akihiro KAWAJIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220240378
- Publication date Jul 28, 2022
- FUJI CORPORATION
- Tasuku TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHAPING METHOD AND SHAPING DEVICE
- Publication number 20220227043
- Publication date Jul 21, 2022
- FUJI CORPORATION
- Kenji TSUKADA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CIRCUIT FORMATION METHOD
- Publication number 20220039263
- Publication date Feb 3, 2022
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT FORMATION METHOD AND CIRCUIT FORMATION DEVICE
- Publication number 20210267054
- Publication date Aug 26, 2021
- FUJI CORPORATION
- Tasuku TAKEUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
PRINTED SUBSTRATE FORMING METHOD, AND PRINTED SUBSTRATE FORMING DEVICE
- Publication number 20210029832
- Publication date Jan 28, 2021
- FUJI CORPORATION
- Ryojiro TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL MULTI-LAYER ELECTRONIC DEVICE PRODUCTION METHOD A...
- Publication number 20200346452
- Publication date Nov 5, 2020
- FUJI CORPORATION
- Ryojiro TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ryojiro TOMINAGA

Person

Patents Grantslast 30 patents

Image processing device, image processing method, and computer read...

Method for manufacturing stack components

Wiring formation method

Electronic circuit production method using 3D layer shaping

Cured resin formation method and cured resin formation device

Circuit formation method

Printed substrate forming method

Three-dimensional multi-layer electronic device production method

Patents Applicationslast 30 patents

CIRCUIT FORMING METHOD AND INFORMATION PROCESSING DEVICE

CIRCUIT FORMING METHOD

PRODUCTION METHOD AND PRODUCTION DEVICE FOR THREE-DIMENSIONALLY FAB...

WIRING FORMATION METHOD

IMAGE PROCESSING DEVICE, IMAGE PROCESSING METHOD, AND PROGRAM

CURED RESIN FORMATION METHOD AND CURED RESIN FORMATION DEVICE

METHOD FOR MANUFACTURING CIRCUIT WIRING BY THREE-DIMENSIONAL ADDITI...

ELECTRONIC CIRCUIT PRODUCTION METHOD USING 3D LAYER SHAPING

METHOD FOR MANUFACTURING STACK COMPONENTS

THREE-DIMENSIONAL MOLDING MACHINE

MULTILAYER CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SHAPING METHOD AND SHAPING DEVICE

CIRCUIT FORMATION METHOD

CIRCUIT FORMATION METHOD AND CIRCUIT FORMATION DEVICE

PRINTED SUBSTRATE FORMING METHOD, AND PRINTED SUBSTRATE FORMING DEVICE

THREE-DIMENSIONAL MULTI-LAYER ELECTRONIC DEVICE PRODUCTION METHOD A...