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Ryosuke Hiwatashi

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of adjusting plating module
    • Patent number 12,163,244
    • Issue date Dec 10, 2024
    • Ebara Corporation
    • Yasuyuki Masuda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    RESISTOR FOR PLATING APPARATUS, AND PLATING APPARATUS
    • Publication number 20250034744
    • Publication date Jan 30, 2025
    • EBARA CORPORATION
    • Ryosuke Hiwatashi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240314936
    • Publication date Sep 19, 2024
    • EBARA CORPORATION
    • Tsubasa ISHII
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240295045
    • Publication date Sep 5, 2024
    • EBARA CORPORATION
    • Tsubasa ISHII
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    RESISTOR AND PLATING APPARATUS
    • Publication number 20240279837
    • Publication date Aug 22, 2024
    • EBARA CORPORATION
    • Ryosuke Hiwatashi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20240247394
    • Publication date Jul 25, 2024
    • EBARA CORPORATION
    • Masashi Shimoyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240218553
    • Publication date Jul 4, 2024
    • EBARA CORPORATION
    • Masashi SHIMOYAMA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240209539
    • Publication date Jun 27, 2024
    • EBARA CORPORATION
    • Masaki TOMITA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF ADJUSTING PLATING MODULE
    • Publication number 20240183059
    • Publication date Jun 6, 2024
    • EBARA CORPORATION
    • Yasuyuki Masuda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF MANUFACTURIN...
    • Publication number 20230383431
    • Publication date Nov 30, 2023
    • EBARA CORPORATION
    • Yasuyuki Masuda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20230366120
    • Publication date Nov 16, 2023
    • EBARA CORPORATION
    • Masashi SHIMOYAMA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20230340688
    • Publication date Oct 26, 2023
    • EBARA CORPORATION
    • Tsubasa ISHII
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20230167574
    • Publication date Jun 1, 2023
    • EBARA CORPORATION
    • Ryosuke Hiwatashi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATE, APPARATUS FOR PLATING, AND METHOD OF MANUFACTURING PLATE
    • Publication number 20220356593
    • Publication date Nov 10, 2022
    • EBARA CORPORATION
    • Yasuyuki Masuda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR