Ryota MITA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Laminate
- Patent number 11,948,907
- Issue date Apr 2, 2024
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet for sintering bonding and sheet for sintering bonding with ba...
- Patent number 11,839,936
- Issue date Dec 12, 2023
- Nitto Denko Corporation
- Ryota Mita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wound body of sheet for sintering bonding with base material
- Patent number 11,697,567
- Issue date Jul 11, 2023
- Nitto Denko Corporation
- Ryota Mita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 11,676,936
- Issue date Jun 13, 2023
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 11,594,513
- Issue date Feb 28, 2023
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 11,456,215
- Issue date Sep 27, 2022
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sinter-bonding composition, sinter-bonding sheet and dicing tape wi...
- Patent number 11,352,527
- Issue date Jun 7, 2022
- Nitto Denko Corporation
- Tomoaki Ichikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20220230989
- Publication date Jul 21, 2022
- Nitto Denko Corporation
- Mayu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE
- Publication number 20210407952
- Publication date Dec 30, 2021
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20210242165
- Publication date Aug 5, 2021
- NITTO DENKO CORPORATION
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20210193523
- Publication date Jun 24, 2021
- NITTO DENKO CORPORATION
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTER-BONDING COMPOSITION, SINTER-BONDING SHEET AND DICING TAPE WI...
- Publication number 20210174984
- Publication date Jun 10, 2021
- NITTO DENKO CORPORATION
- Tomoaki ICHIKAWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
THERMOSETTING SHEET AND DICING DIE BONDING FILM
- Publication number 20210139746
- Publication date May 13, 2021
- Nitto Denko Corporation
- Tomoaki Ichikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOSETTING SHEET AND DICING DIE BONDING FILM
- Publication number 20210139745
- Publication date May 13, 2021
- Nitto Denko Corporation
- Tomoaki Ichikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20210098418
- Publication date Apr 1, 2021
- NITTO DENKO CORPORATION
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTER-BONDING COMPOSITION, SINTER-BONDING SHEET AND DICING TAPE WI...
- Publication number 20200308456
- Publication date Oct 1, 2020
- NITTO DENKO CORPORATION
- Tomoaki ICHIKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SHEET FOR SINTERING BONDING AND SHEET FOR SINTERING BONDING WITH BA...
- Publication number 20200290160
- Publication date Sep 17, 2020
- Nitto Denko Corporation
- Ryota MITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHEET FOR SINTERING BONDING AND SHEET FOR SINTERING BONDING WITH BA...
- Publication number 20200294951
- Publication date Sep 17, 2020
- Nitto Denko Corporation
- Ryota MITA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WOUND BODY OF SHEET FOR SINTERING BONDING WITH BASE MATERIAL
- Publication number 20200290833
- Publication date Sep 17, 2020
- Nitto Denko Corporation
- Ryota MITA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SHEET FOR SINTERING BONDING, SHEET FOR SINTERING BONDING WITH BASE...
- Publication number 20200294952
- Publication date Sep 17, 2020
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR SINTERING BONDING AND SHEET FOR SINTERING BONDING WITH BA...
- Publication number 20200294961
- Publication date Sep 17, 2020
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATING SHEET, PRODUCTION METHOD THEREOF, OPTICAL SEMICONDUCT...
- Publication number 20170152357
- Publication date Jun 1, 2017
- NITTO DENKO CORPORATION
- Hirokazu MATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASE SHEET AND RELEASE SHEET-INCLUDING SILICONE RESIN SHEET
- Publication number 20160176160
- Publication date Jun 23, 2016
- NITTO DENKO CORPORATION
- Ryota MITA
- B32 - LAYERED PRODUCTS
Information Patent Application
ENCAPSULATING SHEET
- Publication number 20140178678
- Publication date Jun 26, 2014
- Nitto Denko Corporation
- Hiroyuki KATAYAMA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Person

Patents Grantslast 30 patents

Laminate

Sheet for sintering bonding and sheet for sintering bonding with ba...

Wound body of sheet for sintering bonding with base material

Manufacturing method for semiconductor device

Manufacturing method for semiconductor device

Manufacturing method for semiconductor device

Sinter-bonding composition, sinter-bonding sheet and dicing tape wi...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

LAMINATE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SINTER-BONDING COMPOSITION, SINTER-BONDING SHEET AND DICING TAPE WI...

THERMOSETTING SHEET AND DICING DIE BONDING FILM

THERMOSETTING SHEET AND DICING DIE BONDING FILM

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SINTER-BONDING COMPOSITION, SINTER-BONDING SHEET AND DICING TAPE WI...

SHEET FOR SINTERING BONDING AND SHEET FOR SINTERING BONDING WITH BA...

SHEET FOR SINTERING BONDING AND SHEET FOR SINTERING BONDING WITH BA...

WOUND BODY OF SHEET FOR SINTERING BONDING WITH BASE MATERIAL

SHEET FOR SINTERING BONDING, SHEET FOR SINTERING BONDING WITH BASE...

SHEET FOR SINTERING BONDING AND SHEET FOR SINTERING BONDING WITH BA...

ENCAPSULATING SHEET, PRODUCTION METHOD THEREOF, OPTICAL SEMICONDUCT...

RELEASE SHEET AND RELEASE SHEET-INCLUDING SILICONE RESIN SHEET

ENCAPSULATING SHEET