Sabine Liebfahrt

Person

Parschlug, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Component carrier with protruding thermally conductive tongue and c...
- Patent number 11,672,076
- Issue date Jun 6, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Naoto Yokoi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,439,018
- Issue date Sep 6, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Sabine Liebfahrt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,412,618
- Issue date Aug 9, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Sabine Liebfahrt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stepped component assembly accommodated within a stepped cavity in...
- Patent number 11,129,314
- Issue date Sep 21, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Using a partially uncured component carrier body for manufacturing...
- Patent number 10,905,016
- Issue date Jan 26, 2021
- AT & Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20220210919
- Publication date Jun 30, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Sabine Liebfahrt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220210920
- Publication date Jun 30, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Sabine Liebfahrt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Protruding Thermally Conductive Tongue and C...
- Publication number 20220030697
- Publication date Jan 27, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Naoto Yokoi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stepped Component Assembly Accommodated Within a Stepped Cavity in...
- Publication number 20190380234
- Publication date Dec 12, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Only Partially Filled Thermal Through-Hole
- Publication number 20190357364
- Publication date Nov 21, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ferdinand Lutschounig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Using a Partially Uncured Component Carrier for Manufacturing Compo...
- Publication number 20180310419
- Publication date Oct 25, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDE...
- Publication number 20110051384
- Publication date Mar 3, 2011
- Arno Kriechbaum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Sabine Liebfahrt

Person

Patents Grantslast 30 patents

Component carrier with protruding thermally conductive tongue and c...

Component carrier and method of manufacturing the same

Component carrier and method of manufacturing the same

Stepped component assembly accommodated within a stepped cavity in...

Using a partially uncured component carrier body for manufacturing...

Patents Applicationslast 30 patents

Component Carrier and Method of Manufacturing the Same

COMPONENT CARRIER AND METHOD OF MANUFACTURING THE SAME

Component Carrier With Protruding Thermally Conductive Tongue and C...

Stepped Component Assembly Accommodated Within a Stepped Cavity in...

Component Carrier With Only Partially Filled Thermal Through-Hole

Using a Partially Uncured Component Carrier for Manufacturing Compo...

PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDE...