Sachiko FUJISAWA

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded body, ceramic copper circuit board, method for manufacturing...
- Patent number 12,160,959
- Issue date Dec 3, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, ceramic copper circuit substrate, and semiconductor de...
- Patent number 12,115,603
- Issue date Oct 15, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, circuit board, and semiconductor device
- Patent number 11,948,900
- Issue date Apr 2, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME
- Publication number 20250098065
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Sachiko FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHO...
- Publication number 20250087576
- Publication date Mar 13, 2025
- Kabushiki Kaisha Toshiba
- Sachiko FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...
- Publication number 20250048563
- Publication date Feb 6, 2025
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RHENIUM-TUNGSTEN ALLOY WIRE, METHOD OF MANUFACTURING SAME, MEDICAL...
- Publication number 20250019804
- Publication date Jan 16, 2025
- Kabushiki Kaisha Toshiba
- Hideaki BABA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
RHENIUM-TUNGSTEN ALLOY WIRE, METHOD OF MANUFACTURING SAME, AND MEDI...
- Publication number 20250019805
- Publication date Jan 16, 2025
- Kabushiki Kaisha Toshiba
- Hideaki BABA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDED BODY, CERAMIC-COPPER CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
- Publication number 20230260868
- Publication date Aug 17, 2023
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
BONDED BODY, CERAMIC CIRCUIT SUBSTRATE, AND SEMICONDUCTOR DEVICE
- Publication number 20230187310
- Publication date Jun 15, 2023
- Kabushiki Kaisha Toshiba
- Seiichi SUENAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20230135530
- Publication date May 4, 2023
- Kabushiki Kaisha Toshiba
- Seiichi SUENAGA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20230140744
- Publication date May 4, 2023
- Kabushiki Kaisha Toshiba
- Seiichi SUENAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY, CERAMIC COPPER CIRCUIT SUBSTRATE, AND SEMICONDUCTOR DE...
- Publication number 20230080016
- Publication date Mar 16, 2023
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRAZING MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FO...
- Publication number 20220288726
- Publication date Sep 15, 2022
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...
- Publication number 20220295644
- Publication date Sep 15, 2022
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
- Publication number 20210398928
- Publication date Dec 23, 2021
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Sachiko FUJISAWA

Person

Patents Grantslast 30 patents

Bonded body, ceramic copper circuit board, method for manufacturing...

Bonded body, ceramic copper circuit substrate, and semiconductor de...

Bonded body, circuit board, and semiconductor device

Patents Applicationslast 30 patents

BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME

BONDED BODY, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHO...

BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...

RHENIUM-TUNGSTEN ALLOY WIRE, METHOD OF MANUFACTURING SAME, MEDICAL...

RHENIUM-TUNGSTEN ALLOY WIRE, METHOD OF MANUFACTURING SAME, AND MEDI...

BONDED BODY, CERAMIC-COPPER CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

BONDED BODY, CERAMIC CIRCUIT SUBSTRATE, AND SEMICONDUCTOR DEVICE

BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

BONDED BODY, CERAMIC COPPER CIRCUIT SUBSTRATE, AND SEMICONDUCTOR DE...

BRAZING MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FO...

BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...

BONDED BODY, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE