Sadasivan Shankar

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Nanowire structures having wrap-around contacts
- Patent number 11,757,026
- Issue date Sep 12, 2023
- Google LLC
- Stephen M. Cea
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Nanowire structures having wrap-around contacts
- Patent number 10,840,366
- Issue date Nov 17, 2020
- Intel Corporation
- Stephen M. Cea
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Nanowire structures having wrap-around contacts
- Patent number 10,483,385
- Issue date Nov 19, 2019
- Intel Corporation
- Stephen M. Cea
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device contacts
- Patent number 9,577,057
- Issue date Feb 21, 2017
- Intel Corporation
- Michael G. Haverty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device contacts
- Patent number 9,166,004
- Issue date Oct 20, 2015
- Intel Corporation
- Michael G. Haverty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner layers for metal interconnects
- Patent number 8,779,589
- Issue date Jul 15, 2014
- Intel Corporation
- Harsono S. Simka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor channel mobility using alternate gate dielectric materials
- Patent number 8,633,534
- Issue date Jan 21, 2014
- Intel Corporation
- Michael G. Haverty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer interlayer dielectric and passivation materials for a micro...
- Patent number 8,154,121
- Issue date Apr 10, 2012
- Intel Corporation
- Kunal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus having plating solution container with current applying a...
- Patent number 7,279,084
- Issue date Oct 9, 2007
- Intel Corporation
- Radek P. Chalupa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Rinse apparatus and method for wafer polisher
- Patent number 7,021,999
- Issue date Apr 4, 2006
- Intel Corporation
- Lei Jiang
- B24 - GRINDING POLISHING
Information Patent Grant
Rinse apparatus and method for wafer polisher
- Patent number 6,908,370
- Issue date Jun 21, 2005
- Intel Corporation
- Lei Jiang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad design
- Patent number 6,887,131
- Issue date May 3, 2005
- Intel Corporation
- Lei Jiang
- B24 - GRINDING POLISHING
Information Patent Grant
Minimization of microelectronic interconnect thickness variations
- Patent number 6,883,153
- Issue date Apr 19, 2005
- Intel Corporation
- Lei Jiang
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
NANOWIRE STRUCTURES HAVING WRAP-AROUND CONTACTS
- Publication number 20210036137
- Publication date Feb 4, 2021
- Intel Corporation
- Stephen M. CEA
- B82 - NANO-TECHNOLOGY
Information Patent Application
NANOWIRE STRUCTURES HAVING WRAP-AROUND CONTACTS
- Publication number 20200035818
- Publication date Jan 30, 2020
- Intel Corporation
- Stephen M. CEA
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE CONTACTS
- Publication number 20170162661
- Publication date Jun 8, 2017
- Intel Corporation
- MICHAEL G. HAVERTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONTACTS
- Publication number 20160043191
- Publication date Feb 11, 2016
- Intel Corporation
- MICHAEL G. HAVERTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE MATERIALS FOR USE IN SEMICONDUCTOR COMPONENTS
- Publication number 20150187900
- Publication date Jul 2, 2015
- Sadasivan Shankar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE STRUCTURES HAVING WRAP-AROUND CONTACTS
- Publication number 20140209855
- Publication date Jul 31, 2014
- Stephen M. Cea
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE CONTACTS
- Publication number 20120161321
- Publication date Jun 28, 2012
- Michael G. Haverty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR CHANNEL MOBILITY USING ALTERNATE GATE DIELECTRIC MATERIALS
- Publication number 20120161251
- Publication date Jun 28, 2012
- Michael G. Haverty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER LAYERS FOR METAL INTERCONNECTS
- Publication number 20120153478
- Publication date Jun 21, 2012
- Harsono S. Simka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER INTERLAYER DIELECTRIC AND PASSIVATION MATERIALS FOR A MICRO...
- Publication number 20090212421
- Publication date Aug 27, 2009
- Kunal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20090166867
- Publication date Jul 2, 2009
- Harsono Simka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RESISTIVITY IN METAL INTERCONNECTS BY COMPRESSIVE STRAINING
- Publication number 20090001591
- Publication date Jan 1, 2009
- Michael Haverty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RESISTIVITY IN METAL INTERCONNECTS USING INTERFACE CONTROL
- Publication number 20090004463
- Publication date Jan 1, 2009
- Michael Haverty
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Bond termination of pores in a porous diamond dielectric material
- Publication number 20070269646
- Publication date Nov 22, 2007
- Michael G. Haverty
- C30 - CRYSTAL GROWTH
Information Patent Application
Dielectric material having carborane derivatives
- Publication number 20070224834
- Publication date Sep 27, 2007
- Michael G. Haverty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of internal stress reduction in dielectric films with chemi...
- Publication number 20070123059
- Publication date May 31, 2007
- Michael G. Haverty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper containing abrasive particles to modify reactivity and perfo...
- Publication number 20060138087
- Publication date Jun 29, 2006
- Harsono S. Simka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Dielectric material having carborane derivatives
- Publication number 20060071300
- Publication date Apr 6, 2006
- Michael G. Haverty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic devices with molecular sieve layers
- Publication number 20060068190
- Publication date Mar 30, 2006
- Intel Corporation
- Michael D. Goodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous ceramic materials as low-k films in semiconductor devices
- Publication number 20050287787
- Publication date Dec 29, 2005
- Grant M. Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rinse apparatus and method for wafer polisher
- Publication number 20050181709
- Publication date Aug 18, 2005
- Lei Jiang
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus having plating solution container with current applying a...
- Publication number 20050173241
- Publication date Aug 11, 2005
- Radek P. Chalupa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RINSE APPARATUS AND METHOD FOR WAFER POLISHER
- Publication number 20050124267
- Publication date Jun 9, 2005
- Lei Jiang
- B24 - GRINDING POLISHING
Information Patent Application
Using benzocyclobutene based polymers as underfill materials
- Publication number 20050054143
- Publication date Mar 10, 2005
- Sergei Skokov
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Using benzocyclobutene based polymers as underfill materials
- Publication number 20040159923
- Publication date Aug 19, 2004
- Sergei Skokov
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Minimization of microelectronic interconnect thickness variations
- Publication number 20040139419
- Publication date Jul 15, 2004
- Lei Jiang
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad design
- Publication number 20040043698
- Publication date Mar 4, 2004
- Lei Jiang
- B24 - GRINDING POLISHING

Sadasivan Shankar

Person

Patents Grantslast 30 patents

Nanowire structures having wrap-around contacts

Nanowire structures having wrap-around contacts

Nanowire structures having wrap-around contacts

Semiconductor device contacts

Semiconductor device contacts

Liner layers for metal interconnects

Transistor channel mobility using alternate gate dielectric materials

Polymer interlayer dielectric and passivation materials for a micro...

Apparatus having plating solution container with current applying a...

Rinse apparatus and method for wafer polisher

Rinse apparatus and method for wafer polisher

Polishing pad design

Minimization of microelectronic interconnect thickness variations

Patents Applicationslast 30 patents

NANOWIRE STRUCTURES HAVING WRAP-AROUND CONTACTS

NANOWIRE STRUCTURES HAVING WRAP-AROUND CONTACTS

SEMICONDUCTOR DEVICE CONTACTS

SEMICONDUCTOR DEVICE CONTACTS

COMPOSITE MATERIALS FOR USE IN SEMICONDUCTOR COMPONENTS

NANOWIRE STRUCTURES HAVING WRAP-AROUND CONTACTS

SEMICONDUCTOR DEVICE CONTACTS

TRANSISTOR CHANNEL MOBILITY USING ALTERNATE GATE DIELECTRIC MATERIALS

LINER LAYERS FOR METAL INTERCONNECTS

POLYMER INTERLAYER DIELECTRIC AND PASSIVATION MATERIALS FOR A MICRO...

METAL INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES

REDUCING RESISTIVITY IN METAL INTERCONNECTS BY COMPRESSIVE STRAINING

REDUCING RESISTIVITY IN METAL INTERCONNECTS USING INTERFACE CONTROL

Bond termination of pores in a porous diamond dielectric material

Dielectric material having carborane derivatives

Methods of internal stress reduction in dielectric films with chemi...

Copper containing abrasive particles to modify reactivity and perfo...

Dielectric material having carborane derivatives

Electronic devices with molecular sieve layers

Porous ceramic materials as low-k films in semiconductor devices

Rinse apparatus and method for wafer polisher

Apparatus having plating solution container with current applying a...

RINSE APPARATUS AND METHOD FOR WAFER POLISHER

Using benzocyclobutene based polymers as underfill materials

Using benzocyclobutene based polymers as underfill materials

Minimization of microelectronic interconnect thickness variations

Polishing pad design