SAIHSI JEN

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TAIPEI-HSIEN, TW

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Patents Grantslast 30 patents

Information Patent Grant
Package substrate having die pad with outer raised portion and inte...
- Patent number 8,546,184
- Issue date Oct 1, 2013
- Texas Instruments Incorporated
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having die pad with outer raised portion and inte...
- Patent number 8,455,989
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package Substrate Having Die Pad with Outer Raised Portion and Inte...
- Publication number 20130122654
- Publication date May 16, 2013
- TEXAS INSTRUMENTS INCORPORATED
- CHIH-CHIEN HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING DIE PAD WITH OUTER RAISED PORTION AND INTE...
- Publication number 20130001760
- Publication date Jan 3, 2013
- TEXAS INSTRUMENTS INCORPORATED
- CHIH-CHIEN HO
- H01 - BASIC ELECTRIC ELEMENTS