Saliya Witharana

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming copper layers
- Patent number 7,413,936
- Issue date Aug 19, 2008
- Intel Corporation
- Hamid Azimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost programmable CPU package/substrate
- Patent number 7,005,727
- Issue date Feb 28, 2006
- Intel Corporation
- Hamid Azimi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Low cost programmable CPU package/substrate
- Publication number 20060060946
- Publication date Mar 23, 2006
- Intel Corporation
- Hamid Azimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low cost programmable CPU package/substrate
- Publication number 20040004232
- Publication date Jan 8, 2004
- Hamid Azimi
- H01 - BASIC ELECTRIC ELEMENTS