Salman Akram

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of bonding a semiconductor device to a support substrate
- Patent number 11,721,788
- Issue date Aug 8, 2023
- Lumileds LLC
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated pocket pixels, imaging devices and systems including the s...
- Patent number 11,664,396
- Issue date May 30, 2023
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale light emitting device package with dome
- Patent number 11,145,794
- Issue date Oct 12, 2021
- Lumileds LLC
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated pocket pixels, imaging devices and systems including the s...
- Patent number 11,127,769
- Issue date Sep 21, 2021
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated pocket pixels, imaging devices and systems including the s...
- Patent number 10,504,948
- Issue date Dec 10, 2019
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid gate dielectrics for semiconductor power devices
- Patent number 10,490,644
- Issue date Nov 26, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising nickel— and copper—containing inte...
- Patent number 10,446,440
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- Salman Akram
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Elevated pocket pixels, imaging devices and systems including the s...
- Patent number 10,181,486
- Issue date Jan 15, 2019
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising nickel- and copper-containing inte...
- Patent number 10,062,608
- Issue date Aug 28, 2018
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
LED with stress-buffer layer under metallization layer
- Patent number 10,050,180
- Issue date Aug 14, 2018
- Lumileds LLC
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid gate dielectrics for semiconductor power devices
- Patent number 10,002,941
- Issue date Jun 19, 2018
- Fairchild Semiconductor Corporation
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for transferring heat from stacked microfeature devices
- Patent number 9,960,148
- Issue date May 1, 2018
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing solder pad topology differences by planarization
- Patent number 9,935,069
- Issue date Apr 3, 2018
- Lumileds LLC
- Jipu Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elevated pocket pixels, imaging devices and systems including the s...
- Patent number 9,911,769
- Issue date Mar 6, 2018
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with stress-buffer layer under metallization layer
- Patent number 9,640,729
- Issue date May 2, 2017
- Koninklijke Philips N.V.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnects and semiconductor structures
- Patent number 9,640,433
- Issue date May 2, 2017
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Elevated pocket pixels, imaging devices and systems including the s...
- Patent number 9,437,762
- Issue date Sep 6, 2016
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching a light emitting device to a support substrate
- Patent number 9,153,758
- Issue date Oct 6, 2015
- Koninklijke Philips N.V.
- Daniel Alexander Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated pocket pixels, imaging devices and systems including the s...
- Patent number 8,816,405
- Issue date Aug 26, 2014
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaged microelectronic imagers having interconnects f...
- Patent number 8,816,463
- Issue date Aug 26, 2014
- Round Rock Research, LLC
- Salman Akram
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of forming vias in semiconductor substrates and resulting st...
- Patent number 8,786,097
- Issue date Jul 22, 2014
- Micron Technology, Inc.
- Charles M. Watkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having copper interconnect for bonding
- Patent number 8,759,970
- Issue date Jun 24, 2014
- Round Rock Research, LLC
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic imagers and methods of packaging microelec...
- Patent number 8,703,518
- Issue date Apr 22, 2014
- Micron Technology, Inc.
- Kyle K. Kirby
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 8,669,179
- Issue date Mar 11, 2014
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnects in a semiconductor structure
- Patent number 8,647,982
- Issue date Feb 11, 2014
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor dice including at least one blind hole, wafers includ...
- Patent number 8,637,962
- Issue date Jan 28, 2014
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 8,502,353
- Issue date Aug 6, 2013
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strained semiconductor by full wafer bonding
- Patent number 8,470,687
- Issue date Jun 25, 2013
- Micron Technology, Inc.
- Leonard Forbes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for breaking surface tension during a recessed...
- Patent number 8,389,920
- Issue date Mar 5, 2013
- Aptina Imaging Corporation
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive vias
- Patent number 8,324,100
- Issue date Dec 4, 2012
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...
- Publication number 20210408093
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...
- Publication number 20200098804
- Publication date Mar 26, 2020
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING NICKEL-AND COPPER-CONTAINING INTER...
- Publication number 20180358263
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...
- Publication number 20180342547
- Publication date Nov 29, 2018
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID GATE DIELECTRICS FOR SEMICONDUCTOR POWER DEVICES
- Publication number 20180269302
- Publication date Sep 20, 2018
- Fairchild Semiconductor Corporation
- Salman AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...
- Publication number 20180175085
- Publication date Jun 21, 2018
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED WITH STRESS-BUFFER LAYER UNDER METALLIZATION LAYER
- Publication number 20170358715
- Publication date Dec 14, 2017
- Koninklijke Philips N.V.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE LIGHT EMITTING DEVICE PACKAGE WITH DOME
- Publication number 20170301834
- Publication date Oct 19, 2017
- Koninklijke Philips N.V.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES
- Publication number 20170283954
- Publication date Oct 5, 2017
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...
- Publication number 20160372505
- Publication date Dec 22, 2016
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID GATE DIELECTRICS FOR SEMICONDUCTOR POWER DEVICES
- Publication number 20160343823
- Publication date Nov 24, 2016
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Salman AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED WITH STRESS-BUFFER LAYER UNDER METALLIZATION LAYER
- Publication number 20160329468
- Publication date Nov 10, 2016
- Koninklijke Philips N.V.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING A SEMICONDUCTOR DEVICE TO A SUPPORT SUBSTRATE
- Publication number 20160247969
- Publication date Aug 25, 2016
- Koninklijke Philips N.V.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING SOLDER PAD TOPOLOGY DIFFERENCES BY PLANARIZATION
- Publication number 20160181216
- Publication date Jun 23, 2016
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...
- Publication number 20150014689
- Publication date Jan 15, 2015
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATTACHING A LIGHT EMITTING DEVICE TO A SUPPORT SUBSTRATE
- Publication number 20140220716
- Publication date Aug 7, 2014
- Koninklijke Philips N.V.
- Daniel Alexandria Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES
- Publication number 20140154879
- Publication date Jun 5, 2014
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20130295766
- Publication date Nov 7, 2013
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DICE INCLUDING AT LEAST ONE BLIND HOLE, WAFERS INCLUD...
- Publication number 20130043588
- Publication date Feb 21, 2013
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR TRANSFERRING HEAT FROM STACKED MICROFEA...
- Publication number 20120135567
- Publication date May 31, 2012
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGED MICROELECTRONIC IMAGERS AND PROCESSES FOR WAFE...
- Publication number 20120104528
- Publication date May 3, 2012
- ROUND ROCK RESEARCH, LLC
- Salman Akram
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGED MICROELECTRONIC IMAGERS AND METHODS OF PACKAGING MICROELEC...
- Publication number 20120009717
- Publication date Jan 12, 2012
- Kyle K. Kirby
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STRAINED SEMICONDUCTOR BY FULL WAFER BONDING
- Publication number 20110281407
- Publication date Nov 17, 2011
- Leonard Forbes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DICE INCLUDING AT LEAST ONE BLIND HOLE, WAFERS INCLUD...
- Publication number 20110272806
- Publication date Nov 10, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20110233777
- Publication date Sep 29, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...
- Publication number 20110189809
- Publication date Aug 4, 2011
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONDUCTIVE VIAS
- Publication number 20110136336
- Publication date Jun 9, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING AND FILLING CONDUCTIVE VIAS AND CONDUCTIVE...
- Publication number 20110095429
- Publication date Apr 28, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC IMAGERS AND METHODS OF PACKAGING MICROELEC...
- Publication number 20110089539
- Publication date Apr 21, 2011
- ROUND ROCK RESEARCH, LLC
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING VIAS IN SEMICONDUCTOR SUBSTRATES AND RESULTING ST...
- Publication number 20110074043
- Publication date Mar 31, 2011
- Micron Technology, Inc.
- Charles M. Watkins
- H01 - BASIC ELECTRIC ELEMENTS

Salman Akram

Person

Patents Grantslast 30 patents

Method of bonding a semiconductor device to a support substrate

Elevated pocket pixels, imaging devices and systems including the s...

Chip scale light emitting device package with dome

Elevated pocket pixels, imaging devices and systems including the s...

Elevated pocket pixels, imaging devices and systems including the s...

Hybrid gate dielectrics for semiconductor power devices

Semiconductor devices comprising nickel— and copper—containing inte...

Elevated pocket pixels, imaging devices and systems including the s...

Semiconductor devices comprising nickel- and copper-containing inte...

LED with stress-buffer layer under metallization layer

Hybrid gate dielectrics for semiconductor power devices

Methods for transferring heat from stacked microfeature devices

Reducing solder pad topology differences by planarization

Elevated pocket pixels, imaging devices and systems including the s...

LED with stress-buffer layer under metallization layer

Methods of forming interconnects and semiconductor structures

Elevated pocket pixels, imaging devices and systems including the s...

Method of attaching a light emitting device to a support substrate

Elevated pocket pixels, imaging devices and systems including the s...

Wafer-level packaged microelectronic imagers having interconnects f...

Method of forming vias in semiconductor substrates and resulting st...

Semiconductor device having copper interconnect for bonding

Packaged microelectronic imagers and methods of packaging microelec...

Through-wafer interconnects for photoimager and memory wafers

Methods of forming interconnects in a semiconductor structure

Semiconductor dice including at least one blind hole, wafers includ...

Through-wafer interconnects for photoimager and memory wafers

Strained semiconductor by full wafer bonding

Method and apparatus for breaking surface tension during a recessed...

Methods of forming conductive vias

Patents Applicationslast 30 patents

ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...

ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...

SEMICONDUCTOR DEVICES COMPRISING NICKEL-AND COPPER-CONTAINING INTER...

ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...

HYBRID GATE DIELECTRICS FOR SEMICONDUCTOR POWER DEVICES

ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...

LED WITH STRESS-BUFFER LAYER UNDER METALLIZATION LAYER

CHIP SCALE LIGHT EMITTING DEVICE PACKAGE WITH DOME

METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES

ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...

HYBRID GATE DIELECTRICS FOR SEMICONDUCTOR POWER DEVICES

LED WITH STRESS-BUFFER LAYER UNDER METALLIZATION LAYER

METHOD OF BONDING A SEMICONDUCTOR DEVICE TO A SUPPORT SUBSTRATE

REDUCING SOLDER PAD TOPOLOGY DIFFERENCES BY PLANARIZATION

ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...

METHOD OF ATTACHING A LIGHT EMITTING DEVICE TO A SUPPORT SUBSTRATE

METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

SEMICONDUCTOR DICE INCLUDING AT LEAST ONE BLIND HOLE, WAFERS INCLUD...

METHODS AND APPARATUSES FOR TRANSFERRING HEAT FROM STACKED MICROFEA...

WAFER-LEVEL PACKAGED MICROELECTRONIC IMAGERS AND PROCESSES FOR WAFE...

PACKAGED MICROELECTRONIC IMAGERS AND METHODS OF PACKAGING MICROELEC...

STRAINED SEMICONDUCTOR BY FULL WAFER BONDING

SEMICONDUCTOR DICE INCLUDING AT LEAST ONE BLIND HOLE, WAFERS INCLUD...

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE S...

METHODS OF FORMING CONDUCTIVE VIAS

METHODS FOR FABRICATING AND FILLING CONDUCTIVE VIAS AND CONDUCTIVE...

PACKAGED MICROELECTRONIC IMAGERS AND METHODS OF PACKAGING MICROELEC...

METHOD OF FORMING VIAS IN SEMICONDUCTOR SUBSTRATES AND RESULTING ST...