Sammy K. Brown

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Los Gatos, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for mounting an integrated circuit having reduced thermal st...
- Patent number 6,436,735
- Issue date Aug 20, 2002
- Alpine Microsystems, Inc.
- Martin P. Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits packaging system and method
- Patent number 6,400,575
- Issue date Jun 4, 2002
- Alpine Microsystems, LLC
- Sammy K. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level burn-in
- Patent number 6,337,576
- Issue date Jan 8, 2002
- Alpine Microsystems, Inc.
- Andrew K. Wiggin
- G01 - MEASURING TESTING
Information Patent Grant
System and method for packaging integrated circuits
- Patent number 6,175,161
- Issue date Jan 16, 2001
- Alpine Microsystems, Inc.
- Martin P. Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional mounting assembly for integrated circuits
- Patent number 6,128,201
- Issue date Oct 3, 2000
- Alpine Microsystems, Inc.
- Sammy K. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for routing connections of integrated circuits
- Patent number 6,075,711
- Issue date Jun 13, 2000
- Alpine Microsystems, Inc.
- Sammy K. Brown
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Circuit interconnect providing reduced crosstalk and simultaneous s...
- Publication number 20010013650
- Publication date Aug 16, 2001
- Martin P. Goetz
- H01 - BASIC ELECTRIC ELEMENTS