Sampath K. V. Karikalan

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded substrate core spiral inductor
- Patent number 10,128,037
- Issue date Nov 13, 2018
- Avago Technologies International Sales Pte. Limited
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic-core three-dimensional (3D) inductors and packaging integr...
- Patent number 9,693,461
- Issue date Jun 27, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interposer having a cavity for intra-interposer die
- Patent number 9,548,251
- Issue date Jan 17, 2017
- Broadcom Corporation
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a bridge interposer
- Patent number 9,431,371
- Issue date Aug 30, 2016
- Broadcom Corporation
- Sampath K. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microbump and sacrificial pad pattern
- Patent number 9,349,697
- Issue date May 24, 2016
- Broadcom Corporation
- Lynn Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mutual capacitance and magnetic field distribution control for tran...
- Patent number 9,338,880
- Issue date May 10, 2016
- Broadcom Corporation
- Sampath Komarapalayam Velayudham Karikalan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked packaging using reconstituted wafers
- Patent number 9,293,393
- Issue date Mar 22, 2016
- Broadcom Corporation
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementations of twisted differential pairs on a circuit board
- Patent number 9,288,893
- Issue date Mar 15, 2016
- Broadcom Corporation
- Sampath Komarapalayam Velayudham Karikalan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System-in-package with integrated socket
- Patent number 9,275,976
- Issue date Mar 1, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of chips and silicon-based trench capacitors using low...
- Patent number 9,236,442
- Issue date Jan 12, 2016
- Broadcom Corporation
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal reference planes in substrates
- Patent number 9,210,795
- Issue date Dec 8, 2015
- Broadcom Corporation
- Sampath Komarapalayam Velayudham Karikalan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with improved testability
- Patent number 9,153,507
- Issue date Oct 6, 2015
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a bridge interposer
- Patent number 9,059,179
- Issue date Jun 16, 2015
- Broadcom Corporation
- Sampath K. V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable interposer with conductive particles
- Patent number 9,041,171
- Issue date May 26, 2015
- Broadcom Corporation
- Sam Ziqun Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with ultra-thin interposer without through-se...
- Patent number 9,013,041
- Issue date Apr 21, 2015
- Broadcom Corporation
- Sampath K. V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated electromagnetic shielding
- Patent number 8,928,128
- Issue date Jan 6, 2015
- Broadcom Corporation
- Sampath K. V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microbump and sacrificial pad pattern
- Patent number 8,907,488
- Issue date Dec 9, 2014
- Broadcom Corporation
- Lynn Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with integrated heat spreaders
- Patent number 8,872,321
- Issue date Oct 28, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interposer configured for magnetic...
- Patent number 8,791,533
- Issue date Jul 29, 2014
- Broadcom Corporation
- Xiangdong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated selectively conductive film i...
- Patent number 8,749,072
- Issue date Jun 10, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component with reduced parasitic inductance and met...
- Patent number 7,002,249
- Issue date Feb 21, 2006
- Primarion, Inc.
- Thomas P. Duffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of packaging two dimensional photonic array de...
- Patent number 6,960,031
- Issue date Nov 1, 2005
- Primarion, Inc.
- Jonathan McFarland
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROMAGNETIC SHIELDING STRUCTURE
- Publication number 20240203898
- Publication date Jun 20, 2024
- Avago Technologies International Sales Pte. Limited
- Jin Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Substrate Core Spiral Inductor
- Publication number 20160300661
- Publication date Oct 13, 2016
- BROADCOM CORPORATION
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGING USING RECONSTITUTED WAFERS
- Publication number 20160155728
- Publication date Jun 2, 2016
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC-CORE THREE-DIMENSIONAL (3D) INDUCTORS AND PACKAGING INTEGR...
- Publication number 20150302974
- Publication date Oct 22, 2015
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A BRIDGE INTERPOSER
- Publication number 20150235992
- Publication date Aug 20, 2015
- BROADCOM CORPORATION
- Sampath K. KARIKALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microbump and Sacrificial Pad Pattern
- Publication number 20150221603
- Publication date Aug 6, 2015
- BROADCOM CORPORATION
- Lynn Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microbump and Sacrificial Pad Pattern
- Publication number 20140183748
- Publication date Jul 3, 2014
- BROADCOM CORPORATION
- Lynn Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGING USING RECONSTITUTED WAFERS
- Publication number 20140151900
- Publication date Jun 5, 2014
- BROADCOM CORPORATION
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF CHIPS AND SILICON-BASED TRENCH CAPACITORS USING LOW...
- Publication number 20140145300
- Publication date May 29, 2014
- BROADCOM CORPORATION
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Electromagnetic Shielding
- Publication number 20130221499
- Publication date Aug 29, 2013
- BROADCOM CORPORATION
- Sampath K.V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System-In-Package with Integrated Socket
- Publication number 20130221500
- Publication date Aug 29, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Selectively Conductive Film I...
- Publication number 20130221525
- Publication date Aug 29, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages with Integrated Heat Spreaders
- Publication number 20130221506
- Publication date Aug 29, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Improved Testability
- Publication number 20130193996
- Publication date Aug 1, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having an Interposer Configured for Magnetic...
- Publication number 20130193587
- Publication date Aug 1, 2013
- BROADCOM CORPORATION
- Xiangdong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Interposer Having a Cavity for Intra-Interposer Die
- Publication number 20130181354
- Publication date Jul 18, 2013
- BROADCOM CORPORATION
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Ultra-Thin Interposer Without Through-Se...
- Publication number 20130168860
- Publication date Jul 4, 2013
- BROADCOM CORPORATION
- Sampath K.V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with a Bridge Interposer
- Publication number 20130168854
- Publication date Jul 4, 2013
- BROADCOM CORPORATION
- Sampath K.V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable Interposer with Conductive Particles
- Publication number 20130168841
- Publication date Jul 4, 2013
- BROADCOM CORPORATION (IRVINE, CA)
- Sam Ziqun Zhao
- B82 - NANO-TECHNOLOGY
Information Patent Application
Stacked Packaging Using Reconstituted Wafers
- Publication number 20130154106
- Publication date Jun 20, 2013
- BROADCOM CORPORATION
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL REFERENCE PLANES IN SUBSTRATES
- Publication number 20130112464
- Publication date May 9, 2013
- BROADCOM CORPORATION
- Sampath Komarapalayam Velayudham Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method of packaging two dimensional photonic array de...
- Publication number 20040120658
- Publication date Jun 24, 2004
- Jonathan McFarland
- G02 - OPTICS
Information Patent Application
Methods and apparatus for reducing parasitic inductance using inter...
- Publication number 20040104456
- Publication date Jun 3, 2004
- Thomas P. Duffy
- H01 - BASIC ELECTRIC ELEMENTS

Sampath K. V. Karikalan

Person

Patents Grantslast 30 patents

Embedded substrate core spiral inductor

Magnetic-core three-dimensional (3D) inductors and packaging integr...

Semiconductor interposer having a cavity for intra-interposer die

Semiconductor package with a bridge interposer

Microbump and sacrificial pad pattern

Mutual capacitance and magnetic field distribution control for tran...

Stacked packaging using reconstituted wafers

Implementations of twisted differential pairs on a circuit board

System-in-package with integrated socket

Integration of chips and silicon-based trench capacitors using low...

Conformal reference planes in substrates

Semiconductor package with improved testability

Semiconductor package with a bridge interposer

Programmable interposer with conductive particles

Semiconductor package with ultra-thin interposer without through-se...

Semiconductor package with integrated electromagnetic shielding

Microbump and sacrificial pad pattern

Semiconductor packages with integrated heat spreaders

Semiconductor package having an interposer configured for magnetic...

Semiconductor package with integrated selectively conductive film i...

Microelectronic component with reduced parasitic inductance and met...

Apparatus and method of packaging two dimensional photonic array de...

Patents Applicationslast 30 patents

ELECTROMAGNETIC SHIELDING STRUCTURE

Embedded Substrate Core Spiral Inductor

STACKED PACKAGING USING RECONSTITUTED WAFERS

MAGNETIC-CORE THREE-DIMENSIONAL (3D) INDUCTORS AND PACKAGING INTEGR...

SEMICONDUCTOR PACKAGE WITH A BRIDGE INTERPOSER

Microbump and Sacrificial Pad Pattern

Microbump and Sacrificial Pad Pattern

STACKED PACKAGING USING RECONSTITUTED WAFERS

INTEGRATION OF CHIPS AND SILICON-BASED TRENCH CAPACITORS USING LOW...

Semiconductor Package with Integrated Electromagnetic Shielding

System-In-Package with Integrated Socket

Semiconductor Package with Integrated Selectively Conductive Film I...

Semiconductor Packages with Integrated Heat Spreaders

Semiconductor Package with Improved Testability

Semiconductor Package Having an Interposer Configured for Magnetic...

Semiconductor Interposer Having a Cavity for Intra-Interposer Die

Semiconductor Package with Ultra-Thin Interposer Without Through-Se...

Semiconductor Package with a Bridge Interposer

Programmable Interposer with Conductive Particles

Stacked Packaging Using Reconstituted Wafers

CONFORMAL REFERENCE PLANES IN SUBSTRATES

Apparatus and method of packaging two dimensional photonic array de...

Methods and apparatus for reducing parasitic inductance using inter...