Samuel D. Naffziger

Person

Fort Collins, CO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Platform power manager for rack level power and thermal constraints
- Patent number 12,298,829
- Issue date May 13, 2025
- Advanced Micro Devices, Inc.
- Indrani Paul
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 12,266,585
- Issue date Apr 1, 2025
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Refreshing displays using on-die cache
- Patent number 12,073,806
- Issue date Aug 27, 2024
- Advanced Micro Devices, Inc.
- Ashish Jain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
GPU chiplets using high bandwidth crosslinks
- Patent number 11,841,803
- Issue date Dec 12, 2023
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Platform power manager for rack level power and thermal constraints
- Patent number 11,703,930
- Issue date Jul 18, 2023
- Advanced Micro Devices, Inc.
- Indrani Paul
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mission mode Vmin prediction and calibration
- Patent number 11,462,294
- Issue date Oct 4, 2022
- Advanced Micro Devices, Inc.
- Ashish Jain
- G11 - INFORMATION STORAGE
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 11,189,540
- Issue date Nov 30, 2021
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 11,164,807
- Issue date Nov 2, 2021
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform power manager for rack level power and thermal constraints
- Patent number 11,073,888
- Issue date Jul 27, 2021
- Advanced Micro Devices, Inc.
- Indrani Paul
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power efficiency optimization in throughput-based workloads
- Patent number 11,054,883
- Issue date Jul 6, 2021
- Advanced Micro Devices, Inc.
- Leonardo De Paula Rosa Piga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexibile interfaces using through-silicon via technology
- Patent number 10,644,826
- Issue date May 5, 2020
- Advanced Micro Devices, Inc.
- John Wuu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Adaptive resizable cache/LCM for improved power
- Patent number 10,452,554
- Issue date Oct 22, 2019
- Advanced Micro Devices, Inc.
- Ihab Amer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 10,431,517
- Issue date Oct 1, 2019
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Swizzling in 3D stacked memory
- Patent number 10,303,398
- Issue date May 28, 2019
- Advanced Micro Devices, Inc.
- John Wuu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Calibrating power supply voltages using reference measurements from...
- Patent number 10,060,955
- Issue date Aug 28, 2018
- Advanced Micro Devices, Inc.
- Aaron J. Grenat
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power management to change power limits based on device skin temper...
- Patent number 9,958,921
- Issue date May 1, 2018
- Advanced Micro Devices, Inc.
- Ashish Jain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adaptive voltage scaling based on stage transitions or ring oscilla...
- Patent number 9,772,676
- Issue date Sep 26, 2017
- Advanced Micro Devices, Inc.
- Stephen Kosonocky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system of sampling to automatically scale digital power...
- Patent number 9,727,435
- Issue date Aug 8, 2017
- Advanced Micro Devices, Inc.
- Samuel D. Naffziger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Using temperature margin to balance performance with power allocation
- Patent number 9,710,034
- Issue date Jul 18, 2017
- Advanced Micro Devices, Inc.
- Samuel D. Naffziger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid system and method for determining performance levels based o...
- Patent number 9,671,767
- Issue date Jun 6, 2017
- Advanced Micro Devices, Inc.
- Samuel D. Naffziger
- G05 - CONTROLLING REGULATING
Information Patent Grant
Replica path timing adjustment and normalization for adaptive volta...
- Patent number 9,575,553
- Issue date Feb 21, 2017
- Advanced Micro Devices, Inc.
- Seng Oon Toh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Performance state boost for multi-core integrated circuit
- Patent number 9,483,092
- Issue date Nov 1, 2016
- Advanced Micro Devices, Inc.
- Samuel Naffziger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Self-adjusting clock doubler and integrated circuit clock distribut...
- Patent number 9,319,037
- Issue date Apr 19, 2016
- Advanced Micro Devices, Inc.
- Arun Sundaresan Iyer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Load step mitigation method and apparatus
- Patent number 9,182,803
- Issue date Nov 10, 2015
- Advanced Micro Devices, Inc.
- Samuel D. Naffziger
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Adaptive temperature and power calculation for integrated circuits
- Patent number 9,170,631
- Issue date Oct 27, 2015
- Advanced Micro Devices, Inc.
- Samuel Naffziger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system of sampling to automatically scale digital power...
- Patent number 9,092,219
- Issue date Jul 28, 2015
- Advanced Micro Devices, Inc.
- Samuel D. Naffziger
- G01 - MEASURING TESTING
Information Patent Grant
Using temperature margin to balance performance with power allocation
- Patent number 9,052,885
- Issue date Jun 9, 2015
- Advanced Micro Devices, Inc.
- Samuel D. Naffziger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for varying sampling frequency to avoid software...
- Patent number 9,052,359
- Issue date Jun 9, 2015
- Advanced Micro Devices, Inc.
- Samuel D. Naffziger
- G01 - MEASURING TESTING
Information Patent Grant
Constraining clock skew in a resonant clocked system
- Patent number 8,975,936
- Issue date Mar 10, 2015
- Advanced Micro Devices, Inc.
- Visvesh S. Sathe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Determining transistor leakage for an integrated circuit
- Patent number 8,942,932
- Issue date Jan 27, 2015
- Advanced Micro Devices, Inc.
- Samuel D. Naffziger
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
LOCAL THERMAL SENSING FOR SYSTEM MONITORING AND CONTROL
- Publication number 20250167050
- Publication date May 22, 2025
- ADVANCED MICRO DEVICES, INC.
- Srividhya Venkataraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MEMORY CONTROLLER CIRCUITRY
- Publication number 20250098181
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Alan D. SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COMPLEX WITH EMBEDDED INTERPOSER
- Publication number 20240404897
- Publication date Dec 5, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GPU CHIPLETS USING HIGH BANDWIDTH CROSSLINKS
- Publication number 20240330196
- Publication date Oct 3, 2024
- ADVANCED MICRO DEVICES, INC.
- Skyler J. SALEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIE PAIR DEVICE PARTITIONING
- Publication number 20240324247
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- Samuel Naffziger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED PROCESS IN PROCESS PAIR WITHOUT FUSES
- Publication number 20240324248
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY
- Publication number 20240321668
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- Thomas D. Burd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER
- Publication number 20240321702
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- Yan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY AWARE STACKING TOPOLOGY
- Publication number 20240321827
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- Omar Zia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE OPTIMIZED TO FUNCTION IN A 3D STACK CONFIGURATION
- Publication number 20240321706
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- William George En
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH CORE EMBEDDED CHIPLET
- Publication number 20240234304
- Publication date Jul 11, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE MULTIPLE-DIE GRAPHICS PROCESSING UNIT
- Publication number 20240193844
- Publication date Jun 13, 2024
- Mark Fowler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PLATFORM POWER MANAGER FOR RACK LEVEL POWER AND THERMAL CONSTRAINTS
- Publication number 20230350480
- Publication date Nov 2, 2023
- ADVANCED MICRO DEVICES, INC.
- Indrani Paul
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-DIE COMMUNICATIONS COUPLINGS USING A SINGLE BRIDGE DIE
- Publication number 20230069294
- Publication date Mar 2, 2023
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MISSION MODE VMIN PREDICTION AND CALIBRATION
- Publication number 20220189576
- Publication date Jun 16, 2022
- ADVANCED MICRO DEVICES, INC.
- Ashish Jain
- G11 - INFORMATION STORAGE
Information Patent Application
REFRESHING DISPLAYS USING ON-DIE CACHE
- Publication number 20220130342
- Publication date Apr 28, 2022
- ADVANCED MICRO DEVICES, INC.
- ASHISH JAIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES
- Publication number 20220059425
- Publication date Feb 24, 2022
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATFORM POWER MANAGER FOR RACK LEVEL POWER AND THERMAL CONSTRAINTS
- Publication number 20210349517
- Publication date Nov 11, 2021
- ADVANCED MICRO DEVICES, INC.
- Indrani Paul
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GPU CHIPLETS USING HIGH BANDWIDTH CROSSLINKS
- Publication number 20200409859
- Publication date Dec 31, 2020
- ADVANCED MICRO DEVICES, INC.
- Skyler J. SALEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PLATFORM POWER MANAGER FOR RACK LEVEL POWER AND THERMAL CONSTRAINTS
- Publication number 20200379544
- Publication date Dec 3, 2020
- ADVANCED MICRO DEVICES, INC.
- Indrani Paul
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES
- Publication number 20190393123
- Publication date Dec 26, 2019
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES
- Publication number 20190393124
- Publication date Dec 26, 2019
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBILE INTERFACES USING THROUGH-SILICON VIA TECHNOLOGY
- Publication number 20190268086
- Publication date Aug 29, 2019
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SWIZZLING IN 3D STACKED MEMORY
- Publication number 20190129651
- Publication date May 2, 2019
- Advanced Micro Devices, Inc.
- John WUU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES
- Publication number 20190067152
- Publication date Feb 28, 2019
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER EFFICIENCY OPTIMIZATION IN THROUGHPUT-BASED WORKLOADS
- Publication number 20180364782
- Publication date Dec 20, 2018
- ADVANCED MICRO DEVICES, INC.
- Leonardo De Paula Rosa Piga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADAPTIVE RESIZABLE CACHE/LCM FOR IMPROVED POWER
- Publication number 20170293564
- Publication date Oct 12, 2017
- Advanced Micro Devices, Inc.
- Ihab Amer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHANGING POWER LIMITS BASED ON DEVICE STATE
- Publication number 20160266629
- Publication date Sep 15, 2016
- Advanced Micro Devices, Inc.
- Ali Akbar Merrikh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER MANAGEMENT TO CHANGE POWER LIMITS BASED ON DEVICE SKIN TEMPER...
- Publication number 20160266628
- Publication date Sep 15, 2016
- Advanced Micro Devices, Inc.
- Ashish Jain
- G01 - MEASURING TESTING
Information Patent Application
REPLICA PATH TIMING ADJUSTMENT AND NORMALIZATION FOR ADAPTIVE VOLTA...
- Publication number 20160179186
- Publication date Jun 23, 2016
- Advanced Micro Devices, Inc.
- Seng Oon Toh
- G06 - COMPUTING CALCULATING COUNTING

Samuel D. Naffziger

Person

Patents Grantslast 30 patents

Platform power manager for rack level power and thermal constraints

Arrangement and thermal management of 3D stacked dies

Refreshing displays using on-die cache

GPU chiplets using high bandwidth crosslinks

Platform power manager for rack level power and thermal constraints

Mission mode Vmin prediction and calibration

Arrangement and thermal management of 3D stacked dies

Arrangement and thermal management of 3D stacked dies

Platform power manager for rack level power and thermal constraints

Power efficiency optimization in throughput-based workloads

Flexibile interfaces using through-silicon via technology

Adaptive resizable cache/LCM for improved power

Arrangement and thermal management of 3D stacked dies

Swizzling in 3D stacked memory

Calibrating power supply voltages using reference measurements from...

Power management to change power limits based on device skin temper...

Adaptive voltage scaling based on stage transitions or ring oscilla...

Method and system of sampling to automatically scale digital power...

Using temperature margin to balance performance with power allocation

Hybrid system and method for determining performance levels based o...

Replica path timing adjustment and normalization for adaptive volta...

Performance state boost for multi-core integrated circuit

Self-adjusting clock doubler and integrated circuit clock distribut...

Load step mitigation method and apparatus

Adaptive temperature and power calculation for integrated circuits

Method and system of sampling to automatically scale digital power...

Using temperature margin to balance performance with power allocation

Method and system for varying sampling frequency to avoid software...

Constraining clock skew in a resonant clocked system

Determining transistor leakage for an integrated circuit

Patents Applicationslast 30 patents

LOCAL THERMAL SENSING FOR SYSTEM MONITORING AND CONTROL

INTEGRATED MEMORY CONTROLLER CIRCUITRY

CHIP COMPLEX WITH EMBEDDED INTERPOSER

GPU CHIPLETS USING HIGH BANDWIDTH CROSSLINKS

DIE PAIR DEVICE PARTITIONING

ADVANCED PROCESS IN PROCESS PAIR WITHOUT FUSES

TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY

BACKSIDE POWER

THERMALLY AWARE STACKING TOPOLOGY

BACK END OF LINE OPTIMIZED TO FUNCTION IN A 3D STACK CONFIGURATION

CHIP PACKAGE WITH CORE EMBEDDED CHIPLET

CONFIGURABLE MULTIPLE-DIE GRAPHICS PROCESSING UNIT

PLATFORM POWER MANAGER FOR RACK LEVEL POWER AND THERMAL CONSTRAINTS

MULTI-DIE COMMUNICATIONS COUPLINGS USING A SINGLE BRIDGE DIE

MISSION MODE VMIN PREDICTION AND CALIBRATION

REFRESHING DISPLAYS USING ON-DIE CACHE

ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES

PLATFORM POWER MANAGER FOR RACK LEVEL POWER AND THERMAL CONSTRAINTS

GPU CHIPLETS USING HIGH BANDWIDTH CROSSLINKS

PLATFORM POWER MANAGER FOR RACK LEVEL POWER AND THERMAL CONSTRAINTS

ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES

ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES

FLEXIBILE INTERFACES USING THROUGH-SILICON VIA TECHNOLOGY

SWIZZLING IN 3D STACKED MEMORY

ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES

POWER EFFICIENCY OPTIMIZATION IN THROUGHPUT-BASED WORKLOADS

ADAPTIVE RESIZABLE CACHE/LCM FOR IMPROVED POWER

CHANGING POWER LIMITS BASED ON DEVICE STATE

POWER MANAGEMENT TO CHANGE POWER LIMITS BASED ON DEVICE SKIN TEMPER...

REPLICA PATH TIMING ADJUSTMENT AND NORMALIZATION FOR ADAPTIVE VOLTA...