Samuel Tam

Person

Dale City, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with a display assembly and silicon circuit board...
- Patent number 10,925,160
- Issue date Feb 16, 2021
- Amazon Technologies, Inc.
- Samuel Waising Tam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Camera assembly with embedded components and redistribution layer i...
- Patent number 10,069,018
- Issue date Sep 4, 2018
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imager module with molded packaging
- Patent number 9,848,111
- Issue date Dec 19, 2017
- Amazon Technologies, Inc.
- Tak Shing Pang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multiple camera alignment system with flexible substrates and stiff...
- Patent number 9,838,600
- Issue date Dec 5, 2017
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multiple camera alignment system with rigid substrates
- Patent number 9,838,599
- Issue date Dec 5, 2017
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Imager module with interposer chip
- Patent number 9,793,316
- Issue date Oct 17, 2017
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED back end assembly and method of manufacturing
- Patent number 9,748,460
- Issue date Aug 29, 2017
- Flextronics AP, LLC
- Samuel Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imager module with castellated interposer chip
- Patent number 9,706,092
- Issue date Jul 11, 2017
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Imager module with molded packaging
- Patent number 9,681,032
- Issue date Jun 13, 2017
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Protective coating for silicon substrate
- Patent number 9,514,925
- Issue date Dec 6, 2016
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level camera module with molded housing and method of manufac...
- Patent number 9,419,032
- Issue date Aug 16, 2016
- Nanchang O-Film Optoelectronics Technology Ltd
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of forming a metallurgical intercon...
- Patent number 9,312,150
- Issue date Apr 12, 2016
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imager module with interposer chip
- Patent number 9,276,140
- Issue date Mar 1, 2016
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module including image sensor die in molded cavity substrate
- Patent number 9,241,097
- Issue date Jan 19, 2016
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module with a molded enclosure contained in a flexible subst...
- Patent number 9,204,025
- Issue date Dec 1, 2015
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solar cell module on molded lead-frame and method of manufacture
- Patent number 9,178,093
- Issue date Nov 3, 2015
- Flextronics AP, LLC
- Samuel Waising Tam
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Camera module package with a folded substrate and laterally positio...
- Patent number 9,167,161
- Issue date Oct 20, 2015
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module housing having built-in conductive traces to accommod...
- Patent number 9,136,289
- Issue date Sep 15, 2015
- Flextronics AP, LLC
- Samuel Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module package with stiffener-mounted image sensor die
- Patent number 9,088,705
- Issue date Jul 21, 2015
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of and device for manufacturing LED assembly using liquid mo...
- Patent number 9,041,019
- Issue date May 26, 2015
- Flextronics AP, LLC
- Samuel Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packages using laser direct structuring
- Patent number 9,018,749
- Issue date Apr 28, 2015
- Flextronics AP, LLC
- Samuel Tam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Folded tape package for electronic devices
- Patent number 8,913,180
- Issue date Dec 16, 2014
- Flextronics AP, LLC
- Samuel Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating stacked packages using laser direct structuring
- Patent number 8,642,387
- Issue date Feb 4, 2014
- Flextronics AP, LLC
- Samuel Tam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated lens and chip assembly for a digital camera
- Patent number 8,477,239
- Issue date Jul 2, 2013
- DigitalOptics Corporation
- Vidyadhar Sitaram Kale
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module with molded tape flip chip imager mount and method of...
- Patent number 8,430,579
- Issue date Apr 30, 2013
- Flextronics AP, LLC
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Folded system-in-package with heat spreader
- Patent number 8,385,073
- Issue date Feb 26, 2013
- Flextronics AP, LLC
- Samuel Tam
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interconnecting a chip and a substrate by bonding pure metal bumps...
- Patent number 8,119,450
- Issue date Feb 21, 2012
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module with premolded lens housing and method of manufacture
- Patent number 8,092,102
- Issue date Jan 10, 2012
- Flextronics AP LLC
- Dongkai Shangguan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated lens and chip assembly for a digital camera
- Patent number 7,872,686
- Issue date Jan 18, 2011
- Flextronics International USA, Inc.
- Vidyadhar Sitaram Kale
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer based camera module and method of manufacture
- Patent number 7,796,187
- Issue date Sep 14, 2010
- Flextronics AP LLC
- Dongkai Shangguan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
CAMERA MODULE ON FLEXIBLE INTERCONNECT TAPE
- Publication number 20240098348
- Publication date Mar 21, 2024
- Meta Platforms Technologies, LLC
- Samuel Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA DEVICE WITH TWO-STAGE ACTUATORS AND CAMERA DEVICE PACKAGING...
- Publication number 20230280637
- Publication date Sep 7, 2023
- Meta Platforms Technologies, LLC
- Vijay Kumar
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
WEARABLE DEVICE APPLICATIONS
- Publication number 20220385796
- Publication date Dec 1, 2022
- Meta Platforms Technologies, LLC
- Samuel Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED BACK END ASSEMBLY AND METHOD OF MANUFACTURING
- Publication number 20140239342
- Publication date Aug 28, 2014
- FLEXTRONICS AP, LLC
- Samuel Tam
- F21 - LIGHTING
Information Patent Application
METHOD OF AND DEVICE FOR MANUFACTURING LED ASSEMBLY USING LIQUID MO...
- Publication number 20140117384
- Publication date May 1, 2014
- FLEXTRONICS AP, LLC
- Samuel Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGES USING LASER DIRECT STRUCTURING
- Publication number 20140110162
- Publication date Apr 24, 2014
- FLEXTRONICS AP, LLC
- Samuel Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING PROTECTIVE COVERS OVER IMAGE CAPTURE DEVICES AN...
- Publication number 20140047711
- Publication date Feb 20, 2014
- Flextronics AP. LLC
- Samuel Waising Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE HOUSING HAVING MOLDED TAPE SUBSTRATE WITH FOLDED LEADS
- Publication number 20130128106
- Publication date May 23, 2013
- FLEXTRONICS AP, LLC
- Samuel Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Metallurgical Intercon...
- Publication number 20130113093
- Publication date May 9, 2013
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGES USING LASER DIRECT STRUCTURING
- Publication number 20130105972
- Publication date May 2, 2013
- FLEXTRONICS AP, LLC
- Samuel Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDED TAPE PACKAGE FOR ELECTRONIC DEVICES
- Publication number 20130083239
- Publication date Apr 4, 2013
- FLEXTRONICS AP, LLC
- Samuel Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE HOUSING HAVING BUILT-IN CONDUCTIVE TRACES TO ACCOMMOD...
- Publication number 20130050571
- Publication date Feb 28, 2013
- FLEXTRONICS AP, LLC
- Samuel Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR CELL MODULE ON MOLDED LEAD-FRAME AND METHODS OF MANUFACTURE
- Publication number 20130032203
- Publication date Feb 7, 2013
- FLEXTRONICS INTERNATIONAL USA, INC.
- Samuel Waising Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER DEPOSITION SYSTEM AND METHOD FOR METAL BUMPS
- Publication number 20130026212
- Publication date Jan 31, 2013
- FLEXTRONICS AP, LLC
- Samuel Waising Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure and Method
- Publication number 20120217635
- Publication date Aug 30, 2012
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Metallurgical Intercon...
- Publication number 20120049357
- Publication date Mar 1, 2012
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure and Method
- Publication number 20120013005
- Publication date Jan 19, 2012
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Camera Module with Premolded Lens Housing and Method of Manufacture
- Publication number 20110299848
- Publication date Dec 8, 2011
- Dongkai Shangguan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Camera module with molded tape flip chip imager mount and method of...
- Publication number 20110194023
- Publication date Aug 11, 2011
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Integrated lens and chip assembly for a digital camera
- Publication number 20110115974
- Publication date May 19, 2011
- Vidyadhar Sitaram Kale
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wafer level camera module with molded housing and method of manufac...
- Publication number 20110037886
- Publication date Feb 17, 2011
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Folded System-In-Package with Heat Spreader
- Publication number 20110007479
- Publication date Jan 13, 2011
- Samuel Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure and Method
- Publication number 20090227072
- Publication date Sep 10, 2009
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Folded package camera module and method of manufacture
- Publication number 20080170141
- Publication date Jul 17, 2008
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Camera module with premolded lens housing and method of manufacture
- Publication number 20070278394
- Publication date Dec 6, 2007
- Dongkai Shangguan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for mounting protective covers over image capture devices an...
- Publication number 20070236591
- Publication date Oct 11, 2007
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
External adjustment mechanism for a camera lens and electronic imager
- Publication number 20070058964
- Publication date Mar 15, 2007
- Dongkai Shangguan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Packaging structure and method
- Publication number 20060255474
- Publication date Nov 16, 2006
- ChipPAC, Inc.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer based camera module and method of manufacture
- Publication number 20060132644
- Publication date Jun 22, 2006
- Dongkai Shangguan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Integrated lens and chip assembly for a digital camera
- Publication number 20050185088
- Publication date Aug 25, 2005
- Vidyadhar Sitaram Kale
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Person

Patents Grantslast 30 patents

Electronic device with a display assembly and silicon circuit board...

Camera assembly with embedded components and redistribution layer i...

Imager module with molded packaging

Multiple camera alignment system with flexible substrates and stiff...

Multiple camera alignment system with rigid substrates

Imager module with interposer chip

LED back end assembly and method of manufacturing

Imager module with castellated interposer chip

Imager module with molded packaging

Protective coating for silicon substrate

Wafer level camera module with molded housing and method of manufac...

Semiconductor device and method of forming a metallurgical intercon...

Imager module with interposer chip

Camera module including image sensor die in molded cavity substrate

Camera module with a molded enclosure contained in a flexible subst...

Solar cell module on molded lead-frame and method of manufacture

Camera module package with a folded substrate and laterally positio...

Camera module housing having built-in conductive traces to accommod...

Camera module package with stiffener-mounted image sensor die

Method of and device for manufacturing LED assembly using liquid mo...

Stacked packages using laser direct structuring

Folded tape package for electronic devices

Method of fabricating stacked packages using laser direct structuring

Integrated lens and chip assembly for a digital camera

Camera module with molded tape flip chip imager mount and method of...

Folded system-in-package with heat spreader

Interconnecting a chip and a substrate by bonding pure metal bumps...

Camera module with premolded lens housing and method of manufacture

Integrated lens and chip assembly for a digital camera

Wafer based camera module and method of manufacture

Patents Applicationslast 30 patents

CAMERA MODULE ON FLEXIBLE INTERCONNECT TAPE

CAMERA DEVICE WITH TWO-STAGE ACTUATORS AND CAMERA DEVICE PACKAGING...

WEARABLE DEVICE APPLICATIONS

LED BACK END ASSEMBLY AND METHOD OF MANUFACTURING

METHOD OF AND DEVICE FOR MANUFACTURING LED ASSEMBLY USING LIQUID MO...

STACKED PACKAGES USING LASER DIRECT STRUCTURING

METHOD FOR MOUNTING PROTECTIVE COVERS OVER IMAGE CAPTURE DEVICES AN...

CAMERA MODULE HOUSING HAVING MOLDED TAPE SUBSTRATE WITH FOLDED LEADS

Semiconductor Device and Method of Forming a Metallurgical Intercon...

STACKED PACKAGES USING LASER DIRECT STRUCTURING

FOLDED TAPE PACKAGE FOR ELECTRONIC DEVICES

CAMERA MODULE HOUSING HAVING BUILT-IN CONDUCTIVE TRACES TO ACCOMMOD...

SOLAR CELL MODULE ON MOLDED LEAD-FRAME AND METHODS OF MANUFACTURE

SOLDER DEPOSITION SYSTEM AND METHOD FOR METAL BUMPS

Packaging Structure and Method

Semiconductor Device and Method of Forming a Metallurgical Intercon...

Packaging Structure and Method

Camera Module with Premolded Lens Housing and Method of Manufacture

Camera module with molded tape flip chip imager mount and method of...

Integrated lens and chip assembly for a digital camera

Wafer level camera module with molded housing and method of manufac...

Folded System-In-Package with Heat Spreader

Packaging Structure and Method

Folded package camera module and method of manufacture

Camera module with premolded lens housing and method of manufacture

Method for mounting protective covers over image capture devices an...

External adjustment mechanism for a camera lens and electronic imager

Packaging structure and method

Wafer based camera module and method of manufacture

Integrated lens and chip assembly for a digital camera