Sandeep Ahuja

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 12,131,977
- Issue date Oct 29, 2024
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 11,842,943
- Issue date Dec 12, 2023
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus and method to provide a thermal parameter report for a mu...
- Patent number 11,543,868
- Issue date Jan 3, 2023
- Intel Corporation
- Tessil Thomas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-surface heat sink suitable for multi-chip packages
- Patent number 11,495,518
- Issue date Nov 8, 2022
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, apparatus and method for controllable processor configurati...
- Patent number 11,137,807
- Issue date Oct 5, 2021
- Intel Corporation
- Sandeep Ahuja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Determining thermal margins in a multi-die processor
- Patent number 10,908,660
- Issue date Feb 2, 2021
- Intel Corporation
- Sandeep Ahuja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and method to provide a thermal parameter report for a mu...
- Patent number 10,877,530
- Issue date Dec 29, 2020
- Intel Corporation
- Tessil Thomas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Maintenance prediction of electronic devices using periodic thermal...
- Patent number 10,667,438
- Issue date May 26, 2020
- Intel Corporation
- Robin A. Steinbrecher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal throttling of electronic devices
- Patent number 10,275,001
- Issue date Apr 30, 2019
- Intel Corporation
- Timothy Y. Kam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Determining thermal margins in a multi-die processor
- Patent number 10,248,173
- Issue date Apr 2, 2019
- Intel Corporation
- Sandeep Ahuja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Securing thermal management parameters in firmware from cyber attack
- Patent number 9,971,890
- Issue date May 15, 2018
- Intel Corporation
- Sandeep Ahuja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated heat spreader that maximizes heat transfer from a multi-...
- Patent number 9,646,910
- Issue date May 9, 2017
- Intel Corporation
- Sandeep Ahuja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Processor having frequency of operation information for guaranteed...
- Patent number 9,494,996
- Issue date Nov 15, 2016
- Intel Corporation
- Ankush Varma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Securing thermal management parameters in firmware from cyber attack
- Patent number 9,355,249
- Issue date May 31, 2016
- Intel Corporation
- Sandeep Ahuja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated heat spreader that maximizes heat transfer from a multi-...
- Patent number 9,257,364
- Issue date Feb 9, 2016
- Intel Corporation
- Sandeep Ahuja
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transient thermal management systems for semiconductor devices
- Patent number 9,142,482
- Issue date Sep 22, 2015
- Intel Corporation
- Sandeep Ahuja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor-based thermal specification enabling a real-time metric for...
- Patent number 9,116,050
- Issue date Aug 25, 2015
- Intel Corporation
- Sandeep Ahuja
- G01 - MEASURING TESTING
Information Patent Grant
Power and thermal optimization of processor and cooling
- Patent number 8,538,598
- Issue date Sep 17, 2013
- Intel Corporation
- Robin A. Steinbrecher
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Sensor-based thermal specification enabling a real-time metric for...
- Patent number 8,260,474
- Issue date Sep 4, 2012
- Intel Corporation
- Sandeep Ahuja
- G01 - MEASURING TESTING
Information Patent Grant
Cooling arrangement to cool components on circuit board
- Patent number 7,751,189
- Issue date Jul 6, 2010
- Intel Corporation
- Sandeep Ahuja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Piezo fans for cooling an electronic device
- Patent number 7,742,299
- Issue date Jun 22, 2010
- Intel Corporation
- Ioan Sauciuc
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat sink mounting and interface mechanism and method of assembling...
- Patent number 7,042,727
- Issue date May 9, 2006
- Intel Corporation
- Neal E. Ulen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR LOCALIZED TEMPERATURE CONTROL AND LEAKAGE...
- Publication number 20240357777
- Publication date Oct 24, 2024
- Berhanu Kebede Wondimu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS
- Publication number 20240260228
- Publication date Aug 1, 2024
- Intel Corporation
- Jimmy Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR IMMERSION COOLING SYSTEMS
- Publication number 20240172393
- Publication date May 23, 2024
- Intel Corporation
- Sandeep Ahuja
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRAT...
- Publication number 20240096741
- Publication date Mar 21, 2024
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...
- Publication number 20240063082
- Publication date Feb 22, 2024
- Intel Corporation
- Barrett M. Faneuf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING SYSTEM WITH FIRST AND SECOND PRIMARY LOOPS
- Publication number 20240064931
- Publication date Feb 22, 2024
- Intel Corporation
- Jimmy CHUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMMERSION COOLING SYSTEM WITH MULTIPLE COOLING LIQUIDS
- Publication number 20240032248
- Publication date Jan 25, 2024
- Intel Corporation
- Sandeep AHUJA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO MONITOR...
- Publication number 20240029539
- Publication date Jan 25, 2024
- Intel Corporation
- Prabhakar Subrahmanyam
- G08 - SIGNALLING
Information Patent Application
METHOD AND APPARATUS FOR REAL TIME, IN-SITU IMMERSION COOLANT CHARA...
- Publication number 20240008226
- Publication date Jan 4, 2024
- Intel Corporation
- Je-Young CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR IMMERSION COOLING SYSTEMS
- Publication number 20230380102
- Publication date Nov 23, 2023
- Intel Corporation
- Sandeep Ahuja
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELECTRONIC SYSTEMS
- Publication number 20230309262
- Publication date Sep 28, 2023
- Intel Corporation
- Liguang DU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20230253288
- Publication date Aug 10, 2023
- Intel Corporation
- Abdulafeez Adebiyi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...
- Publication number 20230038805
- Publication date Feb 9, 2023
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CRIMP A...
- Publication number 20230031457
- Publication date Feb 2, 2023
- Intel Corporation
- Phil Geng
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
COOLING ASSEMBLY WITH STRAP ELEMENT TO DIMINISH LATERAL MOVEMENT OF...
- Publication number 20220174843
- Publication date Jun 2, 2022
- Intel Corporation
- Phil GENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL GRID ARRAY CHIP (BGA) PACKAGE COOLING ASSEMBLY WITH BOLSTER PLATE
- Publication number 20220117080
- Publication date Apr 14, 2022
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING ASSEMBLY WITH DAMPENED OSCILLATION RESPONSE
- Publication number 20220117079
- Publication date Apr 14, 2022
- Intel Corporation
- Phil GENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CONDUCTIVE CHAMBER WITH STIFFENING STRUCTURE FOR THERMAL...
- Publication number 20210410329
- Publication date Dec 30, 2021
- Intel Corporation
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETICALLY SECURED SEMICONDUCTOR CHIP PACKAGE LOADING ASSEMBLY
- Publication number 20210378099
- Publication date Dec 2, 2021
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR SEALED LIQUID COOLING SYSTEM
- Publication number 20210321526
- Publication date Oct 14, 2021
- Devdatta Prakash Kulkarni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS
- Publication number 20210193558
- Publication date Jun 24, 2021
- Intel Corporation
- Ralph V. Miele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LIQUID COOLING
- Publication number 20210185850
- Publication date Jun 17, 2021
- Intel Corporation
- Devdatta Prakash Kulkarni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...
- Publication number 20210043537
- Publication date Feb 11, 2021
- Intel Corporation
- Barrett M. FANEUF
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MU...
- Publication number 20200301490
- Publication date Sep 24, 2020
- Intel Corporation
- Tessil Thomas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-SURFACE HEAT SINK SUITABLE FOR MULTI-CHIP PACKAGES
- Publication number 20200251403
- Publication date Aug 6, 2020
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PIECE HEAT SPREADER FOR MULTI-CHIP PACKAGE
- Publication number 20200194332
- Publication date Jun 18, 2020
- Intel Corporation
- Sandeep Ahuja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Determining Thermal Margins In A Multi-Die Processor
- Publication number 20190204885
- Publication date Jul 4, 2019
- Intel Corporation
- Sandeep Ahuja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System, Apparatus And Method For Controllable Processor Configurati...
- Publication number 20190041925
- Publication date Feb 7, 2019
- Intel Corporation
- Sandeep Ahuja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING USING A WICK WITH VARIED THICKNESS
- Publication number 20180270993
- Publication date Sep 20, 2018
- Intel Corporation
- Devdatta P. Kulkarni
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEATSINK STIFFENER METHOD AND APPARATUS
- Publication number 20180252483
- Publication date Sep 6, 2018
- Intel Corporation
- Phil Geng
- F28 - HEAT EXCHANGE IN GENERAL

Sandeep Ahuja

Person

Patents Grantslast 30 patents

Electronic systems with inverted circuit board with heat sink to ch...

Electronic systems with inverted circuit board with heat sink to ch...

Apparatus and method to provide a thermal parameter report for a mu...

Multi-surface heat sink suitable for multi-chip packages

System, apparatus and method for controllable processor configurati...

Determining thermal margins in a multi-die processor

Apparatus and method to provide a thermal parameter report for a mu...

Maintenance prediction of electronic devices using periodic thermal...

Thermal throttling of electronic devices

Determining thermal margins in a multi-die processor

Securing thermal management parameters in firmware from cyber attack

Integrated heat spreader that maximizes heat transfer from a multi-...

Processor having frequency of operation information for guaranteed...

Securing thermal management parameters in firmware from cyber attack

Integrated heat spreader that maximizes heat transfer from a multi-...

Transient thermal management systems for semiconductor devices

Sensor-based thermal specification enabling a real-time metric for...

Power and thermal optimization of processor and cooling

Sensor-based thermal specification enabling a real-time metric for...

Cooling arrangement to cool components on circuit board

Piezo fans for cooling an electronic device

Heat sink mounting and interface mechanism and method of assembling...

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR LOCALIZED TEMPERATURE CONTROL AND LEAKAGE...

IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS

METHODS AND APPARATUS FOR IMMERSION COOLING SYSTEMS

COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRAT...

ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...

IMMERSION COOLING SYSTEM WITH FIRST AND SECOND PRIMARY LOOPS

IMMERSION COOLING SYSTEM WITH MULTIPLE COOLING LIQUIDS

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO MONITOR...

METHOD AND APPARATUS FOR REAL TIME, IN-SITU IMMERSION COOLANT CHARA...

METHODS AND APPARATUS FOR IMMERSION COOLING SYSTEMS

FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELECTRONIC SYSTEMS

IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CRIMP A...

COOLING ASSEMBLY WITH STRAP ELEMENT TO DIMINISH LATERAL MOVEMENT OF...

BALL GRID ARRAY CHIP (BGA) PACKAGE COOLING ASSEMBLY WITH BOLSTER PLATE

COOLING ASSEMBLY WITH DAMPENED OSCILLATION RESPONSE

THERMALLY CONDUCTIVE CHAMBER WITH STIFFENING STRUCTURE FOR THERMAL...

MAGNETICALLY SECURED SEMICONDUCTOR CHIP PACKAGE LOADING ASSEMBLY

TECHNOLOGIES FOR SEALED LIQUID COOLING SYSTEM

TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS

HYBRID LIQUID COOLING

ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...

APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MU...

MULTI-SURFACE HEAT SINK SUITABLE FOR MULTI-CHIP PACKAGES

MULTI-PIECE HEAT SPREADER FOR MULTI-CHIP PACKAGE

Determining Thermal Margins In A Multi-Die Processor

System, Apparatus And Method For Controllable Processor Configurati...

COOLING USING A WICK WITH VARIED THICKNESS

HEATSINK STIFFENER METHOD AND APPARATUS