Sandeep Gaan

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thin film barrier seed metallization in magnetic-plugged through ho...
- Patent number 11,443,885
- Issue date Sep 13, 2022
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer package-on-package (PoP) with solder array thermal contacts
- Patent number 11,387,175
- Issue date Jul 12, 2022
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with a substrate provided with plasma treatment
- Patent number 11,291,122
- Issue date Mar 29, 2022
- Intel Corporation
- Darko Grujicic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having copper alloy sputter seed layer and high d...
- Patent number 11,037,802
- Issue date Jun 15, 2021
- Intel Corporation
- Robert Alan May
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRC...
- Publication number 20240345324
- Publication date Oct 17, 2024
- Intel Corporation
- Benjamin Duong
- G02 - OPTICS
Information Patent Application
INTEGRATED OPTICAL PHASE CHANGE MATERIALS FOR RECONFIGURABLE OPTICS...
- Publication number 20240176167
- Publication date May 30, 2024
- Intel Corporation
- Benjamin DUONG
- G02 - OPTICS
Information Patent Application
GLASS RECIRCULATOR FOR OPTICAL SIGNAL REROUTING ACROSS PHOTONIC INT...
- Publication number 20240111093
- Publication date Apr 4, 2024
- Intel Corporation
- Benjamin Duong
- G02 - OPTICS
Information Patent Application
GLASS SUBSTRATE EMBEDDED PIC TO PIC AND OFF-CHIP PHOTONIC COMMUNICA...
- Publication number 20230093438
- Publication date Mar 23, 2023
- Intel Corporation
- Benjamin DUONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INTERPOSERS WITH PHOTONIC & ELECTRICAL R...
- Publication number 20220373734
- Publication date Nov 24, 2022
- Intel Corporation
- Benjamin Duong
- G02 - OPTICS
Information Patent Application
APPARATUS WITH A SUBSTRATE PROVIDED WITH PLASMA TREATMENT
- Publication number 20200245472
- Publication date Jul 30, 2020
- Intel Corporation
- Darko GRUJICIC
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERPOSER PACKAGE-ON-PACKAGE (POP) WITH SOLDER ARRAY THERMAL CONTACTS
- Publication number 20200051899
- Publication date Feb 13, 2020
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM BARRIER SEED MATALLIZATION IN MAGNETIC-PLUGGED THROUGH HO...
- Publication number 20190279806
- Publication date Sep 12, 2019
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING COPPER ALLOY SPUTTER SEED LAYER AND HIGH D...
- Publication number 20190259631
- Publication date Aug 22, 2019
- Intel Corporation
- Robert Alan MAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM PASSIVE DEVICES INTEGRATED IN A PACKAGE SUBSTRATE
- Publication number 20190206786
- Publication date Jul 4, 2019
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INTEGRATED PASSIVES
- Publication number 20190006457
- Publication date Jan 3, 2019
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS

Sandeep Gaan

Person

Patents Grantslast 30 patents

Thin film barrier seed metallization in magnetic-plugged through ho...

Interposer package-on-package (PoP) with solder array thermal contacts

Apparatus with a substrate provided with plasma treatment

Package substrate having copper alloy sputter seed layer and high d...

Patents Applicationslast 30 patents

OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRC...

INTEGRATED OPTICAL PHASE CHANGE MATERIALS FOR RECONFIGURABLE OPTICS...

GLASS RECIRCULATOR FOR OPTICAL SIGNAL REROUTING ACROSS PHOTONIC INT...

GLASS SUBSTRATE EMBEDDED PIC TO PIC AND OFF-CHIP PHOTONIC COMMUNICA...

INTEGRATED CIRCUIT PACKAGE INTERPOSERS WITH PHOTONIC & ELECTRICAL R...

APPARATUS WITH A SUBSTRATE PROVIDED WITH PLASMA TREATMENT

INTERPOSER PACKAGE-ON-PACKAGE (POP) WITH SOLDER ARRAY THERMAL CONTACTS

THIN FILM BARRIER SEED MATALLIZATION IN MAGNETIC-PLUGGED THROUGH HO...

PACKAGE SUBSTRATE HAVING COPPER ALLOY SPUTTER SEED LAYER AND HIGH D...

THIN FILM PASSIVE DEVICES INTEGRATED IN A PACKAGE SUBSTRATE

PACKAGE INTEGRATED PASSIVES