Sandeep Razdan

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Socket locator
- Patent number 11,831,093
- Issue date Nov 28, 2023
- Cisco Technology, Inc.
- Matthew J. Traverso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit bridge for photonics and electrical chip integra...
- Patent number 11,784,175
- Issue date Oct 10, 2023
- Cisco Technology, Inc.
- Matthew J. Traverso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics packaging platform
- Patent number 11,762,155
- Issue date Sep 19, 2023
- Cisco Technology, Inc.
- Vipulkumar K. Patel
- G02 - OPTICS
Information Patent Grant
Thermal packaging with fan out wafer level processing
- Patent number 11,756,861
- Issue date Sep 12, 2023
- Cisco Technology, Inc.
- Ashley J. M. Erickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-scale fabrication of optical apparatus
- Patent number 11,391,888
- Issue date Jul 19, 2022
- Cisco Technology, Inc.
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal packaging with fan out wafer level processing
- Patent number 11,373,930
- Issue date Jun 28, 2022
- Cisco Technology, Inc.
- Ashley J. M. Erickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Periscope optical assembly
- Patent number 11,226,450
- Issue date Jan 18, 2022
- Cisco Technology, Inc.
- Matthew J. Traverso
- G02 - OPTICS
Information Patent Grant
Connection features for electronic and optical packaging
- Patent number 11,215,775
- Issue date Jan 4, 2022
- Cisco Technology, Inc.
- Ashley J. Maker
- G02 - OPTICS
Information Patent Grant
Low temperature solder in a photonic device
- Patent number 11,181,689
- Issue date Nov 23, 2021
- Cisco Technology, Inc.
- Sandeep Razdan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit bridge for photonics and electrical chip integra...
- Patent number 11,043,478
- Issue date Jun 22, 2021
- Cisco Technology, Inc.
- Matthew J. Traverso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame lid for in-package optics
- Patent number 11,029,475
- Issue date Jun 8, 2021
- Cisco Technology, Inc.
- Vipulkumar K. Patel
- G02 - OPTICS
Information Patent Grant
Passive fiber to chip coupling using post-assembly laser patterned...
- Patent number 10,962,719
- Issue date Mar 30, 2021
- Cisco Technology, Inc.
- Sandeep Razdan
- G02 - OPTICS
Information Patent Grant
Periscope optical assembly
- Patent number 10,877,219
- Issue date Dec 29, 2020
- Cisco Technology, Inc.
- Matthew J. Traverso
- G02 - OPTICS
Information Patent Grant
Optoelectronic device module having a silicon interposer
- Patent number 10,727,368
- Issue date Jul 28, 2020
- Intel Corporation
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit bonded with interposer
- Patent number 10,564,352
- Issue date Feb 18, 2020
- Cisco Technology, Inc.
- Sandeep Razdan
- G02 - OPTICS
Information Patent Grant
Photonic integrated circuit bonded with interposer
- Patent number 10,393,959
- Issue date Aug 27, 2019
- Cisco Technology, Inc.
- Sandeep Razdan
- G02 - OPTICS
Information Patent Grant
Wafer level optical probing structures for silicon photonics
- Patent number 10,145,758
- Issue date Dec 4, 2018
- Cisco Technology, Inc.
- Matthew J. Traverso
- G02 - OPTICS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 10,128,225
- Issue date Nov 13, 2018
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level integration for photonic chips
- Patent number 9,964,719
- Issue date May 8, 2018
- Cisco Technology, Inc.
- Sandeep Razdan
- G02 - OPTICS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 9,613,934
- Issue date Apr 4, 2017
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxing-encapsulant material for microelectronic packages assembled...
- Patent number 9,504,168
- Issue date Nov 22, 2016
- Intel Corporation
- Sivakumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 8,987,918
- Issue date Mar 24, 2015
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and configurations for surface treatment of an integrate...
- Patent number 8,895,365
- Issue date Nov 25, 2014
- Intel Corporation
- Suriyakala Ramalingam
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flip chip package containing novel underfill materials
- Patent number 8,377,550
- Issue date Feb 19, 2013
- Intel Corporation
- Rajasekaran Swaminathan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
ELECTRO-OPTICAL CIRCUIT
- Publication number 20250012988
- Publication date Jan 9, 2025
- Cisco Technology, Inc.
- Vipulkumar K. PATEL
- G02 - OPTICS
Information Patent Application
PHOTONICS PACKAGING PLATFORM
- Publication number 20230060862
- Publication date Mar 2, 2023
- Cisco Technology, Inc.
- Vipulkumar K. PATEL
- G02 - OPTICS
Information Patent Application
SOCKET LOCATOR
- Publication number 20220320765
- Publication date Oct 6, 2022
- Cisco Technology, Inc.
- Matthew J. TRAVERSO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING
- Publication number 20220278022
- Publication date Sep 1, 2022
- Cisco Technology, Inc.
- Ashley J.M. ERICKSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING
- Publication number 20210305128
- Publication date Sep 30, 2021
- Cisco Technology, Inc.
- Ashley J.M. ERICKSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BRIDGE FOR PHOTONICS AND ELECTRICAL CHIP INTEGRA...
- Publication number 20210280568
- Publication date Sep 9, 2021
- Cisco Technology, Inc.
- Matthew J. TRAVERSO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-SCALE FABRICATION OF OPTICAL APPARATUS
- Publication number 20210141154
- Publication date May 13, 2021
- Cisco Technology, Inc.
- Sandeep RAZDAN
- G02 - OPTICS
Information Patent Application
LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE
- Publication number 20210088722
- Publication date Mar 25, 2021
- Cisco Technology, Inc.
- Sandeep RAZDAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PERISCOPE OPTICAL ASSEMBLY
- Publication number 20210072461
- Publication date Mar 11, 2021
- Cisco Technology, Inc.
- Matthew J. TRAVERSO
- G02 - OPTICS
Information Patent Application
CONNECTION FEATURES FOR ELECTRONIC AND OPTICAL PACKAGING
- Publication number 20210055489
- Publication date Feb 25, 2021
- Cisco Technology, Inc.
- Ashley J. MAKER
- G02 - OPTICS
Information Patent Application
FRAME LID FOR IN-PACKAGE OPTICS
- Publication number 20200319416
- Publication date Oct 8, 2020
- Cisco Technology, Inc.
- Vipulkumar K. PATEL
- G02 - OPTICS
Information Patent Application
PASSIVE FIBER TO CHIP COUPLING USING POST-ASSEMBLY LASER PATTERNED...
- Publication number 20200241207
- Publication date Jul 30, 2020
- Cisco Technology, Inc.
- Sandeep RAZDAN
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUIT BRIDGE FOR PHOTONICS AND ELECTRICAL CHIP INTEGRA...
- Publication number 20190326266
- Publication date Oct 24, 2019
- Cisco Technology, Inc.
- Matthew J. TRAVERSO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE MODULE HAVING A SILICON INTERPOSER
- Publication number 20190006549
- Publication date Jan 3, 2019
- Intel Corporation
- Myung Jin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL OPTICAL PROBING STRUCTURES FOR SILICON PHOTONICS
- Publication number 20180313718
- Publication date Nov 1, 2018
- Cisco Technology, Inc.
- Matthew J. TRAVERSO
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC TRANSCEIVER ASSEMBLIES
- Publication number 20170288780
- Publication date Oct 5, 2017
- Intel Corporation
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20170229438
- Publication date Aug 10, 2017
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...
- Publication number 20170042043
- Publication date Feb 9, 2017
- SIVAKUMAR NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...
- Publication number 20170032991
- Publication date Feb 2, 2017
- Intel Corporation
- John C. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...
- Publication number 20160172222
- Publication date Jun 16, 2016
- Intel Corporation
- John C. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...
- Publication number 20150187622
- Publication date Jul 2, 2015
- John C. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20150162313
- Publication date Jun 11, 2015
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20140264910
- Publication date Sep 18, 2014
- Sandeep Razdan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TECHNIQUES AND CONFIGURATIONS FOR SURFACE TREATMENT OF AN INTEGRATE...
- Publication number 20140061902
- Publication date Mar 6, 2014
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...
- Publication number 20130263446
- Publication date Oct 10, 2013
- Intel Corporation
- Sivakumar Nagarajan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Flip chip package containing novel underfill materials
- Publication number 20110159228
- Publication date Jun 30, 2011
- Rajasekaran Swaminathan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Protective coating for semiconductor substrates
- Publication number 20100155935
- Publication date Jun 24, 2010
- Intel Corporation
- Ed Prack
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Sandeep Razdan

Person

Patents Grantslast 30 patents

Socket locator

Integrated circuit bridge for photonics and electrical chip integra...

Photonics packaging platform

Thermal packaging with fan out wafer level processing

Wafer-scale fabrication of optical apparatus

Thermal packaging with fan out wafer level processing

Periscope optical assembly

Connection features for electronic and optical packaging

Low temperature solder in a photonic device

Integrated circuit bridge for photonics and electrical chip integra...

Frame lid for in-package optics

Passive fiber to chip coupling using post-assembly laser patterned...

Periscope optical assembly

Optoelectronic device module having a silicon interposer

Photonic integrated circuit bonded with interposer

Photonic integrated circuit bonded with interposer

Wafer level optical probing structures for silicon photonics

Interconnect structures with polymer core

Fan-out wafer level integration for photonic chips

Interconnect structures with polymer core

Fluxing-encapsulant material for microelectronic packages assembled...

Interconnect structures with polymer core

Techniques and configurations for surface treatment of an integrate...

Flip chip package containing novel underfill materials

Patents Applicationslast 30 patents

ELECTRO-OPTICAL CIRCUIT

PHOTONICS PACKAGING PLATFORM

SOCKET LOCATOR

THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING

THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING

INTEGRATED CIRCUIT BRIDGE FOR PHOTONICS AND ELECTRICAL CHIP INTEGRA...

WAFER-SCALE FABRICATION OF OPTICAL APPARATUS

LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE

PERISCOPE OPTICAL ASSEMBLY

CONNECTION FEATURES FOR ELECTRONIC AND OPTICAL PACKAGING

FRAME LID FOR IN-PACKAGE OPTICS

PASSIVE FIBER TO CHIP COUPLING USING POST-ASSEMBLY LASER PATTERNED...

INTEGRATED CIRCUIT BRIDGE FOR PHOTONICS AND ELECTRICAL CHIP INTEGRA...

OPTOELECTRONIC DEVICE MODULE HAVING A SILICON INTERPOSER

WAFER LEVEL OPTICAL PROBING STRUCTURES FOR SILICON PHOTONICS

OPTOELECTRONIC TRANSCEIVER ASSEMBLIES

INTERCONNECT STRUCTURES WITH POLYMER CORE

FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...

METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...

METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...

METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...

INTERCONNECT STRUCTURES WITH POLYMER CORE

INTERCONNECT STRUCTURES WITH POLYMER CORE

TECHNIQUES AND CONFIGURATIONS FOR SURFACE TREATMENT OF AN INTEGRATE...

FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...

Flip chip package containing novel underfill materials

Protective coating for semiconductor substrates