Sang Won Yoon

Person

Ann Arbor, MI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Alloy formation control of transient liquid phase bonding
- Patent number 10,058,951
- Issue date Aug 28, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power modules and power module arrays having a modular design
- Patent number 9,642,285
- Issue date May 2, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics devices having thermal stress reduction elements
- Patent number 9,496,214
- Issue date Nov 15, 2016
- Toyota Motor Engineering & Manufacturing North American, Inc.
- Tsuyoshi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient liquid phase bonding process for double sided power modules
- Patent number 9,044,822
- Issue date Jun 2, 2015
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated power module for multi-device parallel operation
- Patent number 8,878,305
- Issue date Nov 4, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuanbo Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power modules and power module arrays having a modular design
- Patent number 8,847,384
- Issue date Sep 30, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Improvements of long term bondline reliability of power electronics...
- Patent number 8,814,030
- Issue date Aug 26, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding area design for transient liquid phase bonding process
- Patent number 8,803,001
- Issue date Aug 12, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant spring interposer for wafer level three dimensional (3D)...
- Patent number 8,564,117
- Issue date Oct 22, 2013
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant spring interposer for wafer level three dimensional (3D)...
- Patent number 8,154,119
- Issue date Apr 10, 2012
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated (multilayer) circuits and process of producing the same
- Patent number 8,138,019
- Issue date Mar 20, 2012
- Toyota Motor Engineering & Manufactruing North America, Inc.
- Sang Won Yoon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Energy harvesting device
- Patent number 7,986,076
- Issue date Jul 26, 2011
- Toyota Motor Engineering & Manufacturing North America, Inc,
- Sang Won Yoon
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
TRANSIENT LIQUID PHASE BONDING PROCESS FOR DOUBLE SIDED POWER MODULES
- Publication number 20150008253
- Publication date Jan 8, 2015
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Modules and Power Module Arrays Having A Modular Design
- Publication number 20140362537
- Publication date Dec 11, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS DEVICES HAVING THERMAL STRESS REDUCTION ELEMENTS
- Publication number 20140346660
- Publication date Nov 27, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tsuyoshi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Modules and Power Module Arrays Having a Modular Design
- Publication number 20140104790
- Publication date Apr 17, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED POWER MODULE FOR MULTI-DEVICE PARALLEL OPERATION
- Publication number 20140097501
- Publication date Apr 10, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuanbo Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY FORMATION CONTROL OF TRANSIENT LIQUID PHASE BONDING
- Publication number 20130270326
- Publication date Oct 17, 2013
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPROVEMENTS OF LONG TERM BONDLINE RELIABILITY OF POWER ELECTRONICS...
- Publication number 20130270327
- Publication date Oct 17, 2013
- Toyota Motor Engineering & Manufacturing North America
- Sang Won Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING AREA DESIGN FOR TRANSIENT LIQUID PHASE BONDING PROCESS
- Publication number 20120325539
- Publication date Dec 27, 2012
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLIANT SPRING INTERPOSER FOR WAFER LEVEL THREE DIMENSIONAL (3D)...
- Publication number 20120193776
- Publication date Aug 2, 2012
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT SPRING INTERPOSER FOR WAFER LEVEL THREE DIMENSIONAL (3D)...
- Publication number 20110241196
- Publication date Oct 6, 2011
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED (MULTILAYER) CIRCUITS AND PROCESS OF PRODUCING THE SAME
- Publication number 20110101533
- Publication date May 5, 2011
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENERGY HARVESTING DEVICE
- Publication number 20110101827
- Publication date May 5, 2011
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- H01 - BASIC ELECTRIC ELEMENTS

Sang Won Yoon

Person

Patents Grantslast 30 patents

Alloy formation control of transient liquid phase bonding

Power modules and power module arrays having a modular design

Power electronics devices having thermal stress reduction elements

Transient liquid phase bonding process for double sided power modules

Integrated power module for multi-device parallel operation

Power modules and power module arrays having a modular design

Improvements of long term bondline reliability of power electronics...

Bonding area design for transient liquid phase bonding process

Compliant spring interposer for wafer level three dimensional (3D)...

Compliant spring interposer for wafer level three dimensional (3D)...

Integrated (multilayer) circuits and process of producing the same

Energy harvesting device

Patents Applicationslast 30 patents

TRANSIENT LIQUID PHASE BONDING PROCESS FOR DOUBLE SIDED POWER MODULES

Power Modules and Power Module Arrays Having A Modular Design

POWER ELECTRONICS DEVICES HAVING THERMAL STRESS REDUCTION ELEMENTS

Power Modules and Power Module Arrays Having a Modular Design

INTEGRATED POWER MODULE FOR MULTI-DEVICE PARALLEL OPERATION

ALLOY FORMATION CONTROL OF TRANSIENT LIQUID PHASE BONDING

IMPROVEMENTS OF LONG TERM BONDLINE RELIABILITY OF POWER ELECTRONICS...

BONDING AREA DESIGN FOR TRANSIENT LIQUID PHASE BONDING PROCESS

COMPLIANT SPRING INTERPOSER FOR WAFER LEVEL THREE DIMENSIONAL (3D)...

COMPLIANT SPRING INTERPOSER FOR WAFER LEVEL THREE DIMENSIONAL (3D)...

INTEGRATED (MULTILAYER) CIRCUITS AND PROCESS OF PRODUCING THE SAME

ENERGY HARVESTING DEVICE