SangDo Lee

Follow

Person

JiangSu, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and electrical parts manufacturing using meta...
- Patent number 8,084,870
- Issue date Dec 27, 2011
- Fairchild Semiconductor Corporation
- Sangdo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including stacked dice and heat sink stru...
- Patent number 7,564,124
- Issue date Jul 21, 2009
- Fairchild Semiconductor Corporation
- SangDo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING META...
- Publication number 20120146204
- Publication date Jun 14, 2012
- Fairchild Semiconductor Corporation
- Sangdo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die package including stacked dice and heat sink stru...
- Publication number 20080054417
- Publication date Mar 6, 2008
- SangDo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS
- Publication number 20070222087
- Publication date Sep 27, 2007
- Sangdo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING META...
- Publication number 20070222042
- Publication date Sep 27, 2007
- Sangdo Lee
- H01 - BASIC ELECTRIC ELEMENTS