TREA

Sangil Lee

Follow

Person

  • Santa Clara, CA, US
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Warpage balancing in thin packages
    • Patent number 10,483,217
    • Issue date Nov 19, 2019
    • Invensas Corporation
    • Belgacem Haba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Hybrid 3D/2.5D interposer
    • Patent number 10,325,880
    • Issue date Jun 18, 2019
    • Invensas Corporation
    • Charles G. Woychik
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Hybrid 3D/2.5D interposer
    • Patent number 10,177,114
    • Issue date Jan 8, 2019
    • Invensas Corporation
    • Charles G. Woychik
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Warpage balancing in thin packages
    • Patent number 9,972,582
    • Issue date May 15, 2018
    • Invensas Corporation
    • Belgacem Haba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Flipped die stack
    • Patent number 9,825,002
    • Issue date Nov 21, 2017
    • Invensas Corporation
    • Rajesh Katkar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stiffened wires for offset BVA
    • Patent number 9,659,848
    • Issue date May 23, 2017
    • Invensas Corporation
    • Grant Villavicencio
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    HYBRID 3D/2.5D INTERPOSER
    • Publication number 20190096849
    • Publication date Mar 28, 2019
    • Invensas Corporation
    • Charles G. Woychik
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Warpage Balancing In Thin Packages
    • Publication number 20180261556
    • Publication date Sep 13, 2018
    • Invensas Corporation
    • Belgacem Haba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Warpage Balancing in Thin Packages
    • Publication number 20180040572
    • Publication date Feb 8, 2018
    • Invensas Corporation
    • Belgacem Haba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Nanoscale Interconnect Array for Stacked Dies
    • Publication number 20170323867
    • Publication date Nov 9, 2017
    • Invensas Corporatoin
    • Liang Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HYBRID 3D/2.5D INTERPOSER
    • Publication number 20170148763
    • Publication date May 25, 2017
    • Invensas Corporation
    • Charles G. Woychik
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STIFFENED WIRES FOR OFFSET BVA
    • Publication number 20170141020
    • Publication date May 18, 2017
    • Invensas Corporation
    • Grant Villavicencio
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIPPED DIE STACK
    • Publication number 20170018529
    • Publication date Jan 19, 2017
    • Invensas Corporation
    • Rajesh Katkar
    • H01 - BASIC ELECTRIC ELEMENTS