Sanjay Misra

Person

Shoreview, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally conductive EMI suppression compositions
- Patent number 9,999,158
- Issue date Jun 12, 2018
- Henkel IP & Holding GmbH
- Sanjay Misra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material with mixed aspect ratio particle dispers...
- Patent number 9,611,414
- Issue date Apr 4, 2017
- Henkel IP & Holding GmbH
- John Timmerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface with non-tacky surface
- Patent number 8,110,919
- Issue date Feb 7, 2012
- The Bergquist Company
- Radesh Jewram
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal interface with non-tacky surface
- Patent number 8,076,773
- Issue date Dec 13, 2011
- The Bergquist Company
- Radesh Jewram
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermally and electrically conductive interconnect structures
- Patent number 7,760,507
- Issue date Jul 20, 2010
- The Bergquist Company
- Radesh Jewram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Morphing fillers and thermal interface materials
- Patent number RE39992
- Issue date Jan 1, 2008
- The Bergquist Company
- Sanjay Misra
- 524 - Synthetic resins or natural rubbers
Information Patent Grant
Thermal interface pad utilizing low melting metal with retention ma...
- Patent number 6,984,685
- Issue date Jan 10, 2006
- The Bergquist Company
- Sanjay Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal diffusion apparatus
- Patent number 6,898,084
- Issue date May 24, 2005
- The Bergquist Company
- Sanjay Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Morphing fillers and thermal interface materials
- Patent number 6,797,758
- Issue date Sep 28, 2004
- The Bergquist Company
- Sanjay Misra
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermally conductive dielectric mounts for printed circuitry and se...
- Patent number 6,649,325
- Issue date Nov 18, 2003
- The Bergquist Company
- Benjamin P. Gundale
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of preparing thermally conductive compounds by liquid metal...
- Patent number 6,624,224
- Issue date Sep 23, 2003
- The Bergquist Company
- Sanjay Misra
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated release films for phase-change interfaces
- Patent number 6,399,209
- Issue date Jun 4, 2002
- The Bergquist Company
- Sanjay Misra
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of preparing thermally conductive compounds by liquid metal...
- Patent number 6,339,120
- Issue date Jan 15, 2002
- The Bergquist Company
- Sanjay Misra
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermally conductive interface pads for electronic devices
- Patent number 6,197,859
- Issue date Mar 6, 2001
- The Bergquist Company
- Kevin L. Green
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermally conductive interface layers
- Patent number 6,165,612
- Issue date Dec 26, 2000
- The Bergquist Company
- Sanjay Misra
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Thermal Interface Material with Mixed Aspect Ratio Particle Dispers...
- Publication number 20190322918
- Publication date Oct 24, 2019
- Henkel IP & Holding GmbH
- JOHN TIMMERMAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermal Interface Material with Mixed Aspect Ratio Particle Dispers...
- Publication number 20170158936
- Publication date Jun 8, 2017
- Henkel IP & Holding GmbH
- JOHN TIMMERMAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermal Interface Material with Mixed Aspect Ratio Particle Dispers...
- Publication number 20160009975
- Publication date Jan 14, 2016
- The Bergquist Company
- John Timmerman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Battery Cell Coatings
- Publication number 20150140411
- Publication date May 21, 2015
- The Bergquist Company
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Conductive EMI Suppression Compositions
- Publication number 20140182924
- Publication date Jul 3, 2014
- The Bergquist Company
- Sanjay Misra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual Cure Thermally Conductive Adhesive
- Publication number 20130042972
- Publication date Feb 21, 2013
- John Timmerman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermal Interface with Non-Tacky Surface
- Publication number 20100309634
- Publication date Dec 9, 2010
- Radesh Jewram
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Oriented Members for Thermally Conductive Interface Structures
- Publication number 20090208722
- Publication date Aug 20, 2009
- John Francis Timmerman
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermally and electrically conductive interconnect structures
- Publication number 20090168354
- Publication date Jul 2, 2009
- Radesh Jewram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface with Non-Tacky Surface
- Publication number 20090166854
- Publication date Jul 2, 2009
- Radesh Jewram
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Thermal diffusion apparatus
- Publication number 20050013119
- Publication date Jan 20, 2005
- Sanjay Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCM/aligned fiber composite thermal interface
- Publication number 20040009353
- Publication date Jan 15, 2004
- Timothy R. Knowles
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Thermal interface pad utilizing low melting metal with retention ma...
- Publication number 20030187116
- Publication date Oct 2, 2003
- The Bergquist Company
- Sanjay Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Morphing fillers and thermal interface materials
- Publication number 20030027910
- Publication date Feb 6, 2003
- The Bergquist Company
- Sanjay Misra
- F28 - HEAT EXCHANGE IN GENERAL

Sanjay Misra

Person

Patents Grantslast 30 patents

Thermally conductive EMI suppression compositions

Thermal interface material with mixed aspect ratio particle dispers...

Thermal interface with non-tacky surface

Thermal interface with non-tacky surface

Thermally and electrically conductive interconnect structures

Morphing fillers and thermal interface materials

Thermal interface pad utilizing low melting metal with retention ma...

Thermal diffusion apparatus

Morphing fillers and thermal interface materials

Thermally conductive dielectric mounts for printed circuitry and se...

Method of preparing thermally conductive compounds by liquid metal...

Integrated release films for phase-change interfaces

Method of preparing thermally conductive compounds by liquid metal...

Thermally conductive interface pads for electronic devices

Thermally conductive interface layers

Patents Applicationslast 30 patents

Thermal Interface Material with Mixed Aspect Ratio Particle Dispers...

Thermal Interface Material with Mixed Aspect Ratio Particle Dispers...

Thermal Interface Material with Mixed Aspect Ratio Particle Dispers...

Battery Cell Coatings

Thermally Conductive EMI Suppression Compositions

Dual Cure Thermally Conductive Adhesive

Thermal Interface with Non-Tacky Surface

Oriented Members for Thermally Conductive Interface Structures

Thermally and electrically conductive interconnect structures

Thermal Interface with Non-Tacky Surface

Thermal diffusion apparatus

PCM/aligned fiber composite thermal interface

Thermal interface pad utilizing low melting metal with retention ma...

Morphing fillers and thermal interface materials