Sankuei Lin

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Los Gatos, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Three dimensional device formation using early removal of sacrifici...
- Patent number 12,230,691
- Issue date Feb 18, 2025
- Applied Materials, Inc.
- Yan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bottom dielectric isolation layers
- Patent number 12,170,230
- Issue date Dec 17, 2024
- Applied Materials, Inc.
- SanKuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap formation processes
- Patent number 11,735,467
- Issue date Aug 22, 2023
- Applied Materials, Inc.
- Ashish Pal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap formation processes
- Patent number 11,211,286
- Issue date Dec 28, 2021
- Applied Materials, Inc.
- Ashish Pal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DRY ETCH FOR NITRIDE EXHUME PROCESSES IN 3D NAND FABRICATION
- Publication number 20240055269
- Publication date Feb 15, 2024
- Applied Materials, Inc.
- Sankuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL DEVICE FORMATION USING EARLY REMOVAL OF SACRIFICI...
- Publication number 20230369453
- Publication date Nov 16, 2023
- Applied Materials, Inc.
- Yan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BOTTOM DIELECTRIC ISOLATION LAYERS
- Publication number 20230037719
- Publication date Feb 9, 2023
- Applied Materials, Inc.
- SanKuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS INTEGRATION TO REDUCE CONTACT RESISTANCE IN SEMICONDUCTOR D...
- Publication number 20220359208
- Publication date Nov 10, 2022
- Sankuei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAP FORMATION PROCESSES
- Publication number 20220115263
- Publication date Apr 14, 2022
- Applied Materials, Inc.
- Ashish Pal
- H01 - BASIC ELECTRIC ELEMENTS