Santos Nazario-Camacho

Person

Woodbridge, VA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging for high-power microwave module
- Patent number 9,859,178
- Issue date Jan 2, 2018
- BAE Systems Information and Electronic Systems Integration Inc.
- Yannick C. Morel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isostress grid array and method of fabrication thereof
- Patent number 8,586,417
- Issue date Nov 19, 2013
- BAE Systems Information and Electronic Systems Integration Inc.
- John A. Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isostress grid array and method of fabrication thereof
- Patent number 8,519,527
- Issue date Aug 27, 2013
- BAE Systems Information and Electronic Systems Integration Inc.
- John A. Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for providing mechanical support to a column grid array p...
- Patent number 6,680,217
- Issue date Jan 20, 2004
- BAE Systems Information and Electronic Systems Integration, Inc.
- Timothy Whalen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for providing mechanical support to a column grid array p...
- Patent number 6,646,356
- Issue date Nov 11, 2003
- BAE Systems, Information and Electronic Systems Integration Inc.
- Timothy Whalen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING FOR HIGH-POWER MICROWAVE MODULE
- Publication number 20160100495
- Publication date Apr 7, 2016
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- YANNICK C. MOREL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ISOSTRESS GRID ARRAY AND METHOD OF FABRICATION THEREOF
- Publication number 20130309815
- Publication date Nov 21, 2013
- BAE Systems Information And Electronic Systems Intergration Inc.
- John A. Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isostress grid array and method of fabrication thereof
- Publication number 20110074009
- Publication date Mar 31, 2011
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- John A. Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for stacking chips within a multichip module package
- Publication number 20050078436
- Publication date Apr 14, 2005
- Keith K. Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROVIDING MECHANICAL SUPPORT TO A COLUMN GRID ARRAY P...
- Publication number 20030209798
- Publication date Nov 13, 2003
- BAE Systems
- Timothy Whalen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus for providing mechanical support to a column grid array p...
- Publication number 20030211653
- Publication date Nov 13, 2003
- BAE SYSTEMS, Information and Electronic Systems Integration, Inc.
- Timothy Whalen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for stacking chips within a multichip module package
- Publication number 20030178715
- Publication date Sep 25, 2003
- BAE Systems
- Keith K. Sturcken
- H01 - BASIC ELECTRIC ELEMENTS

Santos Nazario-Camacho

Person

Patents Grantslast 30 patents

Packaging for high-power microwave module

Isostress grid array and method of fabrication thereof

Isostress grid array and method of fabrication thereof

Apparatus for providing mechanical support to a column grid array p...

Apparatus for providing mechanical support to a column grid array p...

Patents Applicationslast 30 patents

PACKAGING FOR HIGH-POWER MICROWAVE MODULE

ISOSTRESS GRID ARRAY AND METHOD OF FABRICATION THEREOF

Isostress grid array and method of fabrication thereof

Method for stacking chips within a multichip module package

APPARATUS FOR PROVIDING MECHANICAL SUPPORT TO A COLUMN GRID ARRAY P...

Apparatus for providing mechanical support to a column grid array p...

Method for stacking chips within a multichip module package