Sao-Hsia Tang

Person

Hsin-chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board surface structure and fabrication method thereof
- Patent number 8,164,003
- Issue date Apr 24, 2012
- Unimicron Technology Corp.
- Sao-Hsia Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating circuit board with conductive structure
- Patent number 7,350,298
- Issue date Apr 1, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating conductive bump of circuit board
- Patent number 7,341,934
- Issue date Mar 11, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having electrically conductive structure formed betwe...
- Patent number 7,253,364
- Issue date Aug 7, 2007
- Phoenix Precision Technology Corporation
- Sao-Hsia Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating connection terminal of circuit board
- Patent number 7,174,630
- Issue date Feb 13, 2007
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating electrical connection structure of circuit b...
- Patent number 7,151,050
- Issue date Dec 19, 2006
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120175265
- Publication date Jul 12, 2012
- Unimicron Technology Corp.
- Sao-Hsia Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20080217046
- Publication date Sep 11, 2008
- Phoenix Precision Technology Corporation
- Sao-Hsia Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Fabricating Circuit Board with Conductive Structure
- Publication number 20070186412
- Publication date Aug 16, 2007
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball pad surface finish structure of circuit board and fabri...
- Publication number 20060252249
- Publication date Nov 9, 2006
- Shih-Ping Hsu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Processing apparatus for electroplating conductive bumps on organic...
- Publication number 20060252247
- Publication date Nov 9, 2006
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating connection terminal of circuit board
- Publication number 20060090335
- Publication date May 4, 2006
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating electrical connection structure of circuit b...
- Publication number 20060079081
- Publication date Apr 13, 2006
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating conductive bump of circuit board
- Publication number 20060051952
- Publication date Mar 9, 2006
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board having electrically conductive structure formed betwe...
- Publication number 20050029110
- Publication date Feb 10, 2005
- Sao-Hsia Tang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Sao-Hsia Tang

Person

Patents Grantslast 30 patents

Circuit board surface structure and fabrication method thereof

Method for fabricating circuit board with conductive structure

Method for fabricating conductive bump of circuit board

Circuit board having electrically conductive structure formed betwe...

Method for fabricating connection terminal of circuit board

Method for fabricating electrical connection structure of circuit b...

Patents Applicationslast 30 patents

CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF

CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF

Method for Fabricating Circuit Board with Conductive Structure

Solder ball pad surface finish structure of circuit board and fabri...

Processing apparatus for electroplating conductive bumps on organic...

Method for fabricating connection terminal of circuit board

Method for fabricating electrical connection structure of circuit b...

Method for fabricating conductive bump of circuit board

Circuit board having electrically conductive structure formed betwe...