BRIEF DESCRIPTION OF THE DRAWINGS
The present invention can be more fully understood by reading the following detailed description of the preferred embodiments, with reference made to the accompanying drawings, wherein:
FIG. 1 is a cross-sectional view showing the formation of solder balls on a circuit board by stencil printing known in the prior-art;
FIGS. 2A to 2F are cross-sectional views demonstrating the formation of solder material on a circuit board by electroplating known in the prior-art;
FIGS. 3A to 3F are cross-sectional views showing the first embodiment of a method for fabricating a circuit board with a conductive structure of the present invention;
FIGS. 3D′ and 3E′ are cross-sectional views showing another embodiment of FIGS. 3D and 3E;
FIGS. 4A to 4F are cross-sectional views showing the second embodiment of a method for fabricating a circuit board with a conductive structure of the present invention;
FIG. 4E′ is a cross-sectional view showing another embodiment of FIG. 4E;
FIGS. 5A to 5D are cross-sectional views showing the third embodiment of a method for fabricating a circuit board with a conductive structure of the present invention;
FIG. 5C′ is a cross-sectional view showing another embodiment of FIG. 5C;
FIGS. 6A to 6F are cross-sectional views showing the forth embodiment of a method for fabricating a circuit board with a conductive structure of the present invention; and
FIG. 6E′ is a cross-sectional view showing another embodiment of FIG. 6E.