Sarah Haney

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate having undercut portion for stress mitigation
- Patent number 12,113,032
- Issue date Oct 8, 2024
- Avago Technologies International Sales Pte. Limited
- YongIk Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dissipation and shielding improvement using merged PCB bott...
- Patent number 11,723,143
- Issue date Aug 8, 2023
- Avago Technologies International Sales Pte. Limited
- Chang Kyu Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress mitigation structure
- Patent number 11,276,650
- Issue date Mar 15, 2022
- Avago Technologies International Sales Pte. Limited
- YongIk Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with cavity
- Patent number 10,827,617
- Issue date Nov 3, 2020
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing electromagnetic interference (EMI...
- Patent number 10,271,421
- Issue date Apr 23, 2019
- Avago Technologies International Sales Pte. Limited
- Bernhard Gebauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via structures for thermal dissipation
- Patent number 9,997,428
- Issue date Jun 12, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Marshall Maple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with external shield and back-spill barrier for protecting c...
- Patent number 9,974,181
- Issue date May 15, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sarah Haney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE SIDE MOLDED LAND GRID ARRAY PACKAGE PLATFORM USING A SUBSTRA...
- Publication number 20240170384
- Publication date May 23, 2024
- Avago Technologies International Sales Pte. Limited
- Li Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION STRUCTURE
- Publication number 20220165685
- Publication date May 26, 2022
- Avago Technologies International Sales Pte. Limited
- YongIk Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION STRUCTURE
- Publication number 20210134735
- Publication date May 6, 2021
- Avago Technologies International Sales Pte. Limited
- YongIk Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH CAVITY
- Publication number 20200245465
- Publication date Jul 30, 2020
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...
- Publication number 20180098417
- Publication date Apr 5, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Bernhard Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...
- Publication number 20170280561
- Publication date Sep 28, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sarah Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH COMPARTMENTAL SHIELDS FOR ELECTRONIC COM...
- Publication number 20170223839
- Publication date Aug 3, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Padam Jain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORELESS SUBSTRATE HAVING PRIMER LAYERS ADJACENT TO BOTTOM AND TOP...
- Publication number 20170215278
- Publication date Jul 27, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Padam Jain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA STRUCTURES FOR THERMAL DISSIPATION
- Publication number 20170018501
- Publication date Jan 19, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Marshall Maple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES FOR THERMAL DISSIPATION
- Publication number 20170018478
- Publication date Jan 19, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Marshall Maple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD COMPRISING CO-PLANAR SURFACE PADS AND INSULAT...
- Publication number 20150351229
- Publication date Dec 3, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Lea-Teng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Sarah Haney

Person

Patents Grantslast 30 patents

Substrate having undercut portion for stress mitigation

Thermal dissipation and shielding improvement using merged PCB bott...

Stress mitigation structure

Printed circuit board with cavity

Systems and methods for providing electromagnetic interference (EMI...

Via structures for thermal dissipation

Module with external shield and back-spill barrier for protecting c...

Patents Applicationslast 30 patents

DOUBLE SIDE MOLDED LAND GRID ARRAY PACKAGE PLATFORM USING A SUBSTRA...

STRESS MITIGATION STRUCTURE

STRESS MITIGATION STRUCTURE

PRINTED CIRCUIT BOARD WITH CAVITY

SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...

MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...

PRINTED CIRCUIT BOARD WITH COMPARTMENTAL SHIELDS FOR ELECTRONIC COM...

CORELESS SUBSTRATE HAVING PRIMER LAYERS ADJACENT TO BOTTOM AND TOP...

VIA STRUCTURES FOR THERMAL DISSIPATION

VIA STRUCTURES FOR THERMAL DISSIPATION

PRINTED CIRCUIT BOARD COMPRISING CO-PLANAR SURFACE PADS AND INSULAT...