Sashi S. KANDANUR

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Surface finishes with low RBTV for fine and mixed bump pitch archit...
- Patent number 11,935,857
- Issue date Mar 19, 2024
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finishes with low rBTV for fine and mixed bump pitch archit...
- Patent number 11,488,918
- Issue date Nov 1, 2022
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having nonspherical filler particles
- Patent number 11,127,682
- Issue date Sep 21, 2021
- Intel Corporation
- Sashi S. Kandanur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes void free holes
- Patent number 10,856,424
- Issue date Dec 1, 2020
- Intel Corporation
- Sri Ranga Sai Boyapati
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for making a flexible wearable circuit
- Patent number 10,798,817
- Issue date Oct 6, 2020
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Predictive capability for electroplating shield design
- Patent number 10,428,439
- Issue date Oct 1, 2019
- Intel Corporation
- Nicholas S. Haehn
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Stretchable electronic assembly
- Patent number 10,327,330
- Issue date Jun 18, 2019
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE
- Publication number 20240395661
- Publication date Nov 28, 2024
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240332100
- Publication date Oct 3, 2024
- Intel Corporation
- Pratyush Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING T...
- Publication number 20240321657
- Publication date Sep 26, 2024
- Intel Corporation
- Darko Grujicic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES IN BONDED GLASS SUBSTRATES
- Publication number 20240312853
- Publication date Sep 19, 2024
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES IN BONDED GLASS SUBSTRATES
- Publication number 20240312888
- Publication date Sep 19, 2024
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER
- Publication number 20240222248
- Publication date Jul 4, 2024
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES
- Publication number 20240162158
- Publication date May 16, 2024
- Intel Corporation
- Brandon C. Marin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELF-ALIGNMENT OF GLASS CORE HALVES USING PROTRUDED BUMPS
- Publication number 20240071883
- Publication date Feb 29, 2024
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIA WITH A METAL WALL
- Publication number 20230107096
- Publication date Apr 6, 2023
- Intel Corporation
- Darko GRUJICIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...
- Publication number 20230097624
- Publication date Mar 30, 2023
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATES HAVING TRANSVERSE CAPACITORS FOR USE WITH SEMICOND...
- Publication number 20230095846
- Publication date Mar 30, 2023
- Intel Corporation
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS IN THROUGH GLASS VIAS
- Publication number 20230091666
- Publication date Mar 23, 2023
- Intel Corporation
- Benjamin DUONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFECT-FREE THROUGH GLASS VIA METALLIZATION IMPLEMENTING A REVERSE...
- Publication number 20230082385
- Publication date Mar 16, 2023
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...
- Publication number 20230015619
- Publication date Jan 19, 2023
- Intel Corporation
- Kristof DARMAWAIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING USING FLUORESCENCE-BASED ENDPOINT DET...
- Publication number 20210260718
- Publication date Aug 26, 2021
- Intel Corporation
- Srini Raghavan
- B24 - GRINDING POLISHING
Information Patent Application
SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...
- Publication number 20200135679
- Publication date Apr 30, 2020
- Intel Corporation
- Kristof DARMAWAIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING NONSPHERICAL FILLER PARTICLES
- Publication number 20200135648
- Publication date Apr 30, 2020
- Intel Corporation
- Sashi KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER FLEXIBLE/STRETCHABLE ELECTRONIC PACKAGE FOR ADVANCED WE...
- Publication number 20180376585
- Publication date Dec 27, 2018
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE ELECTRONIC ASSEMBLY
- Publication number 20180295720
- Publication date Oct 11, 2018
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES VOID FREE HOLES
- Publication number 20180288885
- Publication date Oct 4, 2018
- Sri Ranga Sai Boyapati
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PREDICTIVE CAPABILITY FOR ELECTROPLATING SHIELD DESIGN
- Publication number 20170140076
- Publication date May 18, 2017
- Intel Corporation
- Nicholas S. HAEHN
- G06 - COMPUTING CALCULATING COUNTING

Sashi S. KANDANUR

Person

Patents Grantslast 30 patents

Surface finishes with low RBTV for fine and mixed bump pitch archit...

Surface finishes with low rBTV for fine and mixed bump pitch archit...

Semiconductor package having nonspherical filler particles

Electronic assembly that includes void free holes

Method for making a flexible wearable circuit

Predictive capability for electroplating shield design

Stretchable electronic assembly

Patents Applicationslast 30 patents

IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE

MEMS DIES EMBEDDED IN GLASS CORES

GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES

PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING T...

VIA STRUCTURES IN BONDED GLASS SUBSTRATES

VIA STRUCTURES IN BONDED GLASS SUBSTRATES

ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER

PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES

SELF-ALIGNMENT OF GLASS CORE HALVES USING PROTRUDED BUMPS

THROUGH GLASS VIA WITH A METAL WALL

METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...

GLASS SUBSTRATES HAVING TRANSVERSE CAPACITORS FOR USE WITH SEMICOND...

CAPACITORS IN THROUGH GLASS VIAS

DEFECT-FREE THROUGH GLASS VIA METALLIZATION IMPLEMENTING A REVERSE...

SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...

CHEMICAL MECHANICAL POLISHING USING FLUORESCENCE-BASED ENDPOINT DET...

SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...

SEMICONDUCTOR PACKAGE HAVING NONSPHERICAL FILLER PARTICLES

MULTI-LAYER FLEXIBLE/STRETCHABLE ELECTRONIC PACKAGE FOR ADVANCED WE...

STRETCHABLE ELECTRONIC ASSEMBLY

ELECTRONIC ASSEMBLY THAT INCLUDES VOID FREE HOLES

PREDICTIVE CAPABILITY FOR ELECTROPLATING SHIELD DESIGN