-
Package substrate
-
Patent number 9,313,911
-
Issue date Apr 12, 2016
-
Murata Manufacturing Co., Ltd.
-
Atsuyoshi Maeda
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
Package substrate
-
Patent number 8,339,797
-
Issue date Dec 25, 2012
-
Murata Manufacturing Co., Ltd.
-
Atsuyoshi Maeda
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
Composite electronic component
-
Patent number 7,929,316
-
Issue date Apr 19, 2011
-
Murata Manufacturing Co., Ltd.
-
Satoru Noda
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
Component incorporating module
-
Patent number 7,885,081
-
Issue date Feb 8, 2011
-
Murata Manufacturing Co., Ltd.
-
Makoto Kawagishi
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
Composite electronic component
-
Patent number 7,684,207
-
Issue date Mar 23, 2010
-
Murata Manufacturing Co., Ltd.
-
Satoru Noda
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
-
-
-
-
-
-